Winsok-Semicon-WSF40P03

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Winsok-Semicon-WSF40P03
WSF40P03  
P-Ch MOSFET  
General Description  
Product Summery  
The
WSF40P03
is the highest performance  
trench P-Ch MOSFET with extreme high cell  
density ,
 
which provide excellent RDSON and  
gate charge
 
for most of the small power  
switching and load
 
switch applications.  
BVDSS  
RDSON  
ID  
-30V  
18mΩ  
-40A  
Applications  
The
WSF40P03
meet the RoHS and Green  
Product requirement
 
with full function  
reliability approved.  
z
Power Magagement in Desktop  
z
DC/DC Converters.  
z
Load Switch  
Features  
TO-252
Pin Configuration  
z
Advanced high cell density Trench technology  
z
Super Low Gate Charge  
z
Excellent CdV/dt effect decline  
z
100% EAS Guaranteed  
z
Green Device Available  
Absolute Maximum Ratings  
Units  
Parameter  
Rating  
Symbol  
Drain-Source Voltage  
-30  
V

DS  

V
V
V

GS  

Gate-Sou
r
ce Voltage  
±
25  
I

D

@T

C

=25
℃  
I

D

@T

C

=100
℃  
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
Continuous Drain Current, V

GS

@ -10V  
Continuous Drain Current, V

GS

@ -10V  
Continuous Drain Current, V

GS

@ -10V  
Continuous Drain Current, V

GS

@ -10V  
Pulsed Drain Current  
-40  
A
-2
5
 
A
–
9.6  
–
7.7  
–
160  
28  
A
A
a
I

DM  

A
b
E

AS  

Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
b
-20  
2.
5  
I

AS  

P

D

@T

A

=25
℃  
Total Power Dissipation  
W
℃
℃
T

STG  

T

J  

Storage
T
e
mperature Range  
-55 to 150  
-55 to 150  
Operating Junction Temperature Range  
Thermal Data  
Symbol  
Parameter  
Typ.  
—  
Max.  
Unit  
℃
/W  
℃
/W  
c
R

q
JA  

50  
Thermal Resistance Junction-Ambient  
Thermal Resistance Junction-Case  
R

θJC  

2.
9  
—  
Note a
 
Pulse width limited by max. junction temperature.  
:
Note b
 
UIS tested and pulse width limited by maximum junction temperature 150

o

C (initial temperature
T
=
25

o

C).  
:
:
j
Note c
 
Surface Mounted on 1in

2

pad area.  
Dec.2014  
Page 1  

WSF40P03  
P-Ch MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
BV

DSS  

Parameter  
Conditions  
V

GS

=0V , I

D

=-250uA  
Min.  
-30  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BV

DSS

Temperature Coefficient  
△
BV

DSS

/△
T

J  

Reference to 25
℃
, I

D

=-1mA  
V

GS

=-10V , I

D

=-
20
A  
-0.022  
15  
—  
V/
℃  
18  
—  
d
R

DS(ON)  

Static Drain-Source On-Resistance

2  

Gate Threshold Voltage  
m
Ω
 
V
26  
V

GS

=-4.5V , I

D

=-
15
A  
—  
20  
V

GS

=V

DS

, I

D

=-250uA  
V

GS(th)  

I

DSS  

-1.
2  
-1.
6  
-2.5  
V

DS

=-24V , V

GS

=0V , T

J

=25
℃  
V

DS

=-24V , V

GS

=0V , T

J

=55
℃  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
3.5  
11  
5
-1  
-5  
Drain-Source Leakage Current  
uA  
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

R

g  

Gate-Source Leakage Current  
Gate Resistance  
±
100  
—  
nA  
V

DS

=0V , V

GS

=0V , f=1MHz  
Ω
Total Gate Charge  
Q

g  

—  
V

DS

=-15
V
, V

GS

=-4.5
V
,  
I

DS

=-20A  
Gate-Source Charge  
—  
nC  
ns  
Q

gs  

Q

gd  

T

d(on)  

T

r  

5
—  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
11  
10  
20  
18  
70  
53  
V =-15
V
,
 
R
=
15
 
,  
W
DD  
L
I

DS

=-1A, V

GEN

=-10
V
,  
R =6  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
39  
29  
W
G
e
C

iss  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
1256  
187  
115  
1633  
—  
V

GS

=0
V
,  
V

DS

=-15
V
,  
Frequency=1.0MHz  
e
pF  
C

oss  

e
C

rss  

—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V

G

=V

D

=0V , Force Current  
V

GS

=0V , I

S

=-1A  
Min.  
—  
Typ.  
—  
Max.  
–
20  
Unit  
A
I

S  

Continuous Source Current  
Diode Forward Voltage  
d
V

SD  

—  
—  
-1.2  
V
t

rr  

Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
12  
—  
—  
nS  
nC  
I
F
=-
20
A , dI/dt=100A/µs  
Q

rr  

3.5  
:
Note d
 
Pulse test ; pulse width
≤
300 s,
 
duty cycle
≤
2%.  
m
:
Note e
 
Guaranteed by design, not subject to production testing.  
Dec.2014  
Page
2  

WSF40P03  
P-Ch MOSFET  
Typical Operating Characteristics  
Power Dissipation  
Drain Current  
45  
40  
35  
30  
25  
20  
15  
10  
5
45  
40  
35  
30  
25  
20  
15  
10  
5
T

C

=25

o

C,V

G

=-10V  
20 40 60 80
 
100 120 140 160  
T

C

=25

o

C  
0
0
0
0
20 40 60 80
 
100 120 140 160  
T

j

– Junction Temperature (°C)  
T

j

– Junction Temperature (°C)  
Safe Operation Area  
Thermal Transient Impedance  
3
1
Duty = 0.5  
0.2  
0.1  
0.05  
0.1  
0.01  
1E-3  
1E-4  
0.02  
0.01  
Single Pulse  
R

q
JC

:2.9

o

C/W  
1E-6 1E-5 1E-4 1E-3  
0.01  
0.1  
-V

DS

– Drain – Source Voltage (V)  
Square Wave Pulse Duration (sec)  
Dec.2014  
Page
3  

WSF40P03  
P-Ch MOSFET  
Typical Operating Characteristics(Cont.)  
Output Characteristics  
Drain-Source On Resistance  
100  
45  
40  
35  
30  
25  
20  
15  
10  
5
80  
V

G
S

=-6,-7,-8,-9,-10V  
V

G
S

=-4.5V  
-5V  
60  
-4.5V  
40  
-4V  
V

G
S

=-10V  
20  
0
-3.5V  
-3V  
4
0
1
2
3
5
6
0
10  
20  
30  
40  
50  
-V

DS

– Drain – Source Voltage (V)  
-I

D

– Drain Current (A)  
Gate Charge  
Capacitance  
1800  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
10  
9
8
7
6
5
4
3
2
1
0
Frequency=1MHz  
V

DS

= -15V  
I

DS

= -20A  
Ciss  
Coss  
Crss  
0
5
10  
15  
20  
25  
30  
0
4
8
12  
16  
20  
24  
-V

DS

– Drain-Source Voltage (V)  
Q

G

– Gate Charge (nC)  
Dec.2014  
Page
4  

WSF40P03  
P-Ch MOSFET  
Typical Operating Characteristics(Cont.)  
Transfer Characteristics  
60  
50  
40  
30  
20  
T
=
125

o

C  
j
10  
T
=
25

o

C  
j
0
1
2
3
4
5
6
7
-V

GS

– Gate-Source Voltage (V)  
Dec.2014  
Page
5
 

Attention
ꢀ
 
1,
ꢀ
Any
ꢀ
and
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein
ꢀ
do
ꢀ
not
ꢀ
have
ꢀ
specifications
ꢀ
that
ꢀ
can
ꢀ
handle
ꢀ  
applications
ꢀ
that
ꢀ
require
ꢀ
extremely
ꢀ
high
ꢀ
levels
ꢀ
of
ꢀ
reliability,
ꢀ
such
ꢀ
as
ꢀ
life
Ͳ
support
ꢀ
systems,
ꢀ
aircraft’s
ꢀ
control
ꢀ
systems,
ꢀ
or
ꢀ  
other
ꢀ
applications
ꢀ
whose
ꢀ
failure
ꢀ
can
ꢀ
be
ꢀ
reasonably
ꢀ
expected
ꢀ
to
ꢀ
result
ꢀ
in
ꢀ
serious
ꢀ
physical
ꢀ
and/or
ꢀ
material
ꢀ
damage.
ꢀ ꢀ  
Consult
ꢀ
with
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your
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Winsok
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power
ꢀ
representative
ꢀ
nearest
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you
ꢀ
before
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using
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any
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Winsok
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power
ꢀ
products
ꢀ
described
ꢀ
or
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contained
ꢀ
herein
ꢀ
in
ꢀ
such
ꢀ
applications.
ꢀ  
2,Winsok
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power
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assumes
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no
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responsibility
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for
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equipment
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failures
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that
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result
ꢀ
from
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using
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products
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at
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values
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that
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exceed,
ꢀ ꢀ  
even
ꢀ
momentarily,
ꢀ
rated
ꢀ
values
ꢀ
(such
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as
ꢀ
maximum
ꢀ
ratings,
ꢀ
operating
ꢀ
condition
ꢀ
ranges,
ꢀ
or
ꢀ
other
ꢀ
parameters)
ꢀ
listed
ꢀ
in
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products
ꢀ
specifications
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of
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any
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and
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all
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Winsok
ꢀ
power
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products
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described
ꢀ
or
ꢀ
contained
ꢀ
herein.
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3,
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Specifications
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of
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any
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and
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all
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Winsok
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power
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products
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described
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or
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contained
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herein
ꢀ
stipulate
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the
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performance,
ꢀ  
characteristics,
ꢀ
and
ꢀ
functions
ꢀ
of
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the
ꢀ
described
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products
ꢀ
in
ꢀ
the
ꢀ
independent
ꢀ
state,
ꢀ
and
ꢀ
are
ꢀ
not
ꢀ
guarantees
ꢀ
of
ꢀ
the
ꢀ  
performance,
ꢀ
characteristics,
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and
ꢀ
functions
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of
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the
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described
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products
ꢀ
as
ꢀ
mounted
ꢀ
in
ꢀ
the
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customer’s
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products
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or
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equipment.
ꢀ
T
o
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verify
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symptoms
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and
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states
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that
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cannot
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be
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evaluated
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in
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an
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independent
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device,
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the
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customer
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should
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always
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evaluate
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and
ꢀ
test
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devices
ꢀ
mounted
ꢀ
in
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the
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customer’s
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products
ꢀ
or
ꢀ
equipment.
ꢀ  
4,
ꢀ
Winsok
ꢀ
power
ꢀ
Semiconductor
ꢀ
CO.,
ꢀ
LTD.
ꢀ
strives
ꢀ
to
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supply
ꢀ
high
Ͳ
quality
ꢀ
high
Ͳ
reliability
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products.
ꢀ
However,
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any
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and
ꢀ
all
ꢀ  
semiconductor
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products
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fail
ꢀ
with
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some
ꢀ
probability.
ꢀ
It
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is
ꢀ
possible
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that
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these
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probabilistic
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failures
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could
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give
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rise
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to
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accidents
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or
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events
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that
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could
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endanger
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human
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lives
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that
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could
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give
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rise
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to
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smoke
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or
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fire,
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or
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that
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could
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cause
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damage
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to
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other
ꢀ  
property.
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When
ꢀ
designing
ꢀ
equipment,
ꢀ
adopt
ꢀ
safety
ꢀ
measures
ꢀ
so
ꢀ
that
ꢀ
these
ꢀ
kinds
ꢀ
of
ꢀ
accidents
ꢀ
or
ꢀ
events
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cannot
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occur.
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Such
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measures
ꢀ
include
ꢀ
but
ꢀ
are
ꢀ
not
ꢀ
limited
ꢀ
to
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protective
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circuits
ꢀ
and
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error
ꢀ
prevention
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circuits
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for
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safe
ꢀ
design,
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redundant
ꢀ
design,
ꢀ  
and
ꢀ
structural
ꢀ
design.
ꢀ  
5,In
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the
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event
ꢀ
that
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any
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or
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all
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Winsok
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power
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products(including
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data,
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described
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contained
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herein
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are
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controlled
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under
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any
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of
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applicable
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local
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export
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control
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laws
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and
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regulations,
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such
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must
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not
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be
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exported
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without
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obtaining
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the
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export
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license
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from
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the
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authorities
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concerned
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in
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accordance
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with
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the
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above
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law.
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6,
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No
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part
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of
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this
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publication
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may
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be
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reproduced
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transmitted
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in
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form
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or
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by
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means,
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or
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including
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or
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retrieval
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prior
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written
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permission
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of
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Winsok
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Semiconductor
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CO.,
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LTD.
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7,
ꢀ
Information
ꢀ
(including
ꢀ
circuit
ꢀ
diagrams
ꢀ
and
ꢀ
circuit
ꢀ
parameters)
ꢀ
herein
ꢀ
is
ꢀ
for
ꢀ
example
ꢀ
only;
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it
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is
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not
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guaranteed
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for
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volume
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production. Winsok
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information
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herein
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is
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accurate
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reliable,
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but
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no
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are
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made
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or
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implied
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regarding
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its
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use
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or
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any
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of
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intellectual
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rights
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or
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other
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rights
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of
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third
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parties.
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8,
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Any
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and
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all
ꢀ
information
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein
ꢀ
are
ꢀ
subject
ꢀ
to
ꢀ
change
ꢀ
without
ꢀ
notice
ꢀ
due
ꢀ
to
ꢀ
product/technology
ꢀ  
improvement,etc.
ꢀ
When
ꢀ
designing
ꢀ
equipment,
ꢀ
refer
ꢀ
to
ꢀ
the
ꢀ
“Delivery
ꢀ
Specification”
ꢀ
for
ꢀ
the
ꢀ
Winsok
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power
ꢀ
product
ꢀ
that
ꢀ
you
ꢀ ꢀ  
Intend
ꢀ
to
ꢀ
use.
ꢀ  
9,
ꢀ
this
ꢀ
catalog
ꢀ
provides
ꢀ
information
ꢀ
as
ꢀ
of
ꢀ
Sep.2014. Specifications
ꢀ
and
ꢀ
information
ꢀ
herein
ꢀ
are
ꢀ
subject
ꢀ
to
ꢀ
change
ꢀ
without
ꢀ  
notice.
ꢀ