Winsok-Semicon-WSF90N10

Part #Winsok-Semicon-WSF90N10
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Winsok-Semicon-WSF90N10
WSF
9
0N10  
N-Ch MOSFET  
General Description  
Product Summery  
The
WSF
9
0N10
is the highest performance  
trench
N-Ch MOSFET
with extreme high cell  
density ,
 
which provide excellent RDSON and  
gate charge
 
for most of the synchronous buck  
converter applications
 
.  
BV

DSS  

R

DSON  

6
m
Ω
 
I

D  

9
0
A  
100V  
Applications  
The
WSF
9
0N10
meet the RoHS and Green  
Product requirement
,1
00% EAS guaranteed  
with full
 
function reliability approved.  
z
Power Management in TV Converter.  
z
DC-DC Converter  
z
LED TV Back Light  
Features  
z
Advanced high cell density Trench technology  
z
Super Low Gate Charge  
TO
–
252 Pin Configuration  
z
Excellent CdV/dt effect decline  
z
100% EAS Guaranteed  
z
Green Device Available  
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
100  
Units  
V
Drain-Source Voltage  
V

GS  

Gate-Sou
r
ce Voltage  
±
2
0
 
V
I

D

@T

C

=25
℃  
I

D

@T

C

=100
℃  
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I

DM  

Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

Pulsed Drain Current

2
,

T

C

=25°C  
Avalanche Energy, Single pulse,L=0.5mH  
Avalanche Current, Single pulse,L=0.5mH  
9
0
 
50  
13  
10  
A
A
A
A
300  
180  
A
EAS  
mJ  
A
I

AS  

2
7  
104  
42  
Total Power Dissipation

4  

Total Power Dissipation

4  

W
W
℃
℃
P

D

@T

C

=25
℃  
P

D

@T

C

=
10
0
℃  
T

STG  

T

J  

Storage
T
e
mperature Range  
-55 to 150  
-55 to 150  
Operating Junction Temperature Range  
Thermal Data  
Symbol  
R

θ
JA  

Parameter  
Typ.  
—  
Max.  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-Ambient

1  

Thermal Resistance Junction-Case

1  

5
0  
1
.
2  
R

θ
JC  

—  
Rev
1.0
Jul. 20
23  
Page 1  

WSF
9
0N10  
N-Ch MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
100  
—  
Typ.  
—  
Max.  
—  
Unit  
V
BV

DSS  

Drain-Source Breakdown Voltage  
BV

DSS

Temperature Coefficient  
Static Drain-Source On-Resistance

2  

0.096  
6
—  
△
BV

DSS

/△
T

J  

Reference to 25
℃
, I

D

=1mA  
V

GS

=10V , I

D

=
15
A  
V/
℃  
m
Ω
 
m
Ω  
9
R

DS(ON)  

R

DS(ON)  

V

GS(th)  

—  
Static Drain-Source On-Resistance

2  

—  
1
.0  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
15  
10  
1
.
6  
-5.5  
—  
V

GS

=
4.5
V , I

D

=
10
A  
Gate Threshold Voltage  
2
.
5  
—  
V
V

GS

=V

DS

, I

D

=250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
mV/
℃  
V

DS

=80V , V

GS

=0V , T

J

=25
℃  
V

DS

=80V , V

GS

=0V , T

J

=55
℃  
1
I

DSS  

Drain-Source Leakage Current  
uA  
—  
5
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
nA  
S
40  
V

DS

=5V , I

D

=30A  
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
1.
1  
43  
9.5  
9.0  
18  
11  
55  
70  
1
.8  
—  
Ω
Q

g  

Total Gate Charge (10V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
V

DS

=
3
0V , V

GS

=10V , I

D

=
15
A  
nC  
ns  
Q

gs  

Q

gd  

T

d(on)  

T

r  

—  
—  
—  
—  
V

DD

=50V , V

GS

=10V , R

G

=3
Ω
,  
I

D

=
1
A  
—  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
—  
—  
—  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
2
4
00  
3
55  
60  
V

DS

=
50
V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
—  
Typ.  
—  
Max.  
4
0
 
Unit  
A
I

S  

I

SM  

V

SD  

t

rr  

Continuous Source Current

1,6  

Pulsed Source Current

2,6  

Diode Forward Voltage

2  

Reverse Recovery Time  
Reverse Recovery Charge  
V

G

=V

D

=0V , Force Current  
—  
—  
16
0  
1.
3  
—  
A
—  
—  
V
V

GS

=0V , I

S

=1
5
A , T

J

=25
℃  
—  
48  
70  
nS  
nC  
I
F
=
1
5
A
,
dI/dt=100A/µs
,
T

J

=
25
℃  
Q

rr  

—  
—  
Note :  
1.
The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper
,t<10sec
.  
2.
The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%  
3.
The EAS data shows Max. rating . The test condition is V

DS

=
50
V,V

GS

=10V,L=0.
5
mH,I

AS

=
2
7
A  
4.
The power dissipation is limited by 150
℃
junction temperature  
5.
The Min. value is 100% EAS tested guarantee.  
6.
The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
Rev
1.0
Jul. 20
23  
Page
2
 

WSF
9
0N10  
N-Ch MOSFET  
Typical Operating Characteristics  
Power Dissipation  
Drain Current  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
10
0  
9
0  
8
0  
7
0  
6
0  
5
0  
4
0  
3
0  
2
0  
0
V

G

=10V  
0
20 40 60 80
 
100 120 140 160  
0
20 40 60 80
 
100 120 140 160  
T

C

– Case Temperature (°C)  
T

C

– Case Temperature (°C)  
Safe Operation Area  
Thermal Transient Impedance  
3
1
Duty = 0.5  
0.2  
0.1  
0.05  
0.1  
0.01  
1E-3  
1E-4  
0.02  
0.01  
Single Pulse  
R

q
JC

: 1.2

o

C/W  
1E-6 1E-5 1E-4 1E-3 0.01  
0.1 0.3  
V

DS

– Drain – Source Voltage (V)  
Square Wave Pulse Duration (sec)  
Rev
1.0
Jul. 20
23  
Page
3
 

WSF
9
0N10  
N-Ch MOSFET  
Typical Operating Characteristics  
Safe Operation Area  
Thermal Transient Impedance  
3
1
Duty = 0.5  
0.2  
0.1  
0.05  
0.1  
0.01  
1E-3  
0.02  
0.01  
Single Pulse  
Mounted on 1in

2

pad  
R

q
JA

:50

o

C/W  
1E-4 1E-3 0.01
 
0.1  
1
10 100
 
1000  
V

DS

– Drain – Source Voltage (V)  
Output Characteristics  
Square Wave Pulse Duration (sec)  
Drain-Source On Resistance  
200  
18  
V

G
S

=5,6,7,8,9,10V  
15  
4.5V  
4V  
160  
120  
80  
40  
0
V

G
S

=4.5V  
12  
9
6
3.5V  
V

G
S

=10V  
3
0
3V  
3
0
1
2
4
5
0
30  
60  
90  
120  
150  
V

DS

– Drain – Source Voltage (V)  
I

D

– Drain Current (A)  
Rev
1.0
Jul. 20
23  
Page
4
 

WSF
9
0N10  
N-Ch MOSFET  
Typical Operating Characteristics  
Gate-Source On Resistance  
Gate Threshold Voltage  
35  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
I

DS

=
15
A  
I

DS

=250
m
A  
30  
25  
20  
15  
10  
5
0
2
3
4
5
6
7
8
9
10  
-50 -25  
0
25 50 75
 
100 125 150  
V

GS

– Gate – Source Voltage (V)  
Drain-Source On Resistance  
T

j

– Junction Temperature (°C)  
Source-Drain Diode Forward  
100  
10  
1
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V

G
S

=10V  
I

DS

=
15
A  
T
=
150

o

C  
T
=
25

o

C  
j
j
R

O
N

@
T
=25

o

C:
6.
0
m
W
 
j
0.1  
-50 -25  
0
25 50 75
 
100 125 150  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
T

j

– Junction Temperature (°C)  
V

SD

– Source – Drain Voltage (V)  
Rev
1.0
Jul. 20
23  
Page
5
 

WSF
9
0N10  
N-Ch MOSFET  
Typical Operating Characteristics  
Capacitance  
Gate Charge  
3200  
10  
9
8
7
6
5
4
3
2
1
0
Frequency=1MHz  
V

DS

=50V  
2800  
I

DS

=
15
A  
Ciss  
2400  
2000  
1600  
1200  
800  
Coss  
400  
0
Crss  
0
10 20 30 40 50 60 70 80  
0
6
12 18 24 30 36 42  
V

DS

– Drain-Source Voltage (V)  
Transfer Characteristics  
Q

G

– Gate Charge (nC)  
120  
100  
80  
60  
40  
20  
0
T
=
25

o

C  
T
=
150

o

C  
j
j
1
2
3
4
5
6
V

GS

– Gate-Source Voltage (V)  
Rev
1.0
Jul. 20
23  
Page
6
 

Attention
ꢀ
 
1,
ꢀ
Any
ꢀ
and
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein
ꢀ
do
ꢀ
not
ꢀ
have
ꢀ
specifications
ꢀ
that
ꢀ
can
ꢀ
handle
ꢀ  
applications
ꢀ
that
ꢀ
require
ꢀ
extremely
ꢀ
high
ꢀ
levels
ꢀ
of
ꢀ
reliability,
ꢀ
such
ꢀ
as
ꢀ
life
Ͳ
support
ꢀ
systems,
ꢀ
aircraft’s
ꢀ
control
ꢀ
systems,
ꢀ
or
ꢀ  
other
ꢀ
applications
ꢀ
whose
ꢀ
failure
ꢀ
can
ꢀ
be
ꢀ
reasonably
ꢀ
expected
ꢀ
to
ꢀ
result
ꢀ
in
ꢀ
serious
ꢀ
physical
ꢀ
and/or
ꢀ
material
ꢀ
damage.
ꢀ ꢀ  
Consult
ꢀ
with
ꢀ
your
ꢀ
Winsok
ꢀ
power
ꢀ
representative
ꢀ
nearest
ꢀ
you
ꢀ
before
ꢀ
using
ꢀ
any
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ  
contained
ꢀ
herein
ꢀ
in
ꢀ
such
ꢀ
applications.
ꢀ  
2,Winsok
ꢀ
power
ꢀ
assumes
ꢀ
no
ꢀ
responsibility
ꢀ
for
ꢀ
equipment
ꢀ
failures
ꢀ
that
ꢀ
result
ꢀ
from
ꢀ
using
ꢀ
products
ꢀ
at
ꢀ
values
ꢀ
that
ꢀ
exceed,
ꢀ ꢀ  
even
ꢀ
momentarily,
ꢀ
rated
ꢀ
values
ꢀ
(such
ꢀ
as
ꢀ
maximum
ꢀ
ratings,
ꢀ
operating
ꢀ
condition
ꢀ
ranges,
ꢀ
or
ꢀ
other
ꢀ
parameters)
ꢀ
listed
ꢀ
in
ꢀ  
products
ꢀ
specifications
ꢀ
of
ꢀ
any
ꢀ
and
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein.
ꢀ  
3,
ꢀ
Specifications
ꢀ
of
ꢀ
any
ꢀ
and
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein
ꢀ
stipulate
ꢀ
the
ꢀ
performance,
ꢀ  
characteristics,
ꢀ
and
ꢀ
functions
ꢀ
of
ꢀ
the
ꢀ
described
ꢀ
products
ꢀ
in
ꢀ
the
ꢀ
independent
ꢀ
state,
ꢀ
and
ꢀ
are
ꢀ
not
ꢀ
guarantees
ꢀ
of
ꢀ
the
ꢀ  
performance,
ꢀ
characteristics,
ꢀ
and
ꢀ
functions
ꢀ
of
ꢀ
the
ꢀ
described
ꢀ
products
ꢀ
as
ꢀ
mounted
ꢀ
in
ꢀ
the
ꢀ
customer’s
ꢀ
products
ꢀ
or
ꢀ  
equipment.
ꢀ
T
o
ꢀ
verify
ꢀ
symptoms
ꢀ
and
ꢀ
states
ꢀ
that
ꢀ
cannot
ꢀ
be
ꢀ
evaluated
ꢀ
in
ꢀ
an
ꢀ
independent
ꢀ
device,
ꢀ
the
ꢀ
customer
ꢀ
should
ꢀ
always
ꢀ  
evaluate
ꢀ
and
ꢀ
test
ꢀ
devices
ꢀ
mounted
ꢀ
in
ꢀ
the
ꢀ
customer’s
ꢀ
products
ꢀ
or
ꢀ
equipment.
ꢀ  
4,
ꢀ
Winsok
ꢀ
power
ꢀ
Semiconductor
ꢀ
CO.,
ꢀ
LTD.
ꢀ
strives
ꢀ
to
ꢀ
supply
ꢀ
high
Ͳ
quality
ꢀ
high
Ͳ
reliability
ꢀ
products.
ꢀ
However,
ꢀ
any
ꢀ
and
ꢀ
all
ꢀ  
semiconductor
ꢀ
products
ꢀ
fail
ꢀ
with
ꢀ
some
ꢀ
probability.
ꢀ
It
ꢀ
is
ꢀ
possible
ꢀ
that
ꢀ
these
ꢀ
probabilistic
ꢀ
failures
ꢀ
could
ꢀ
give
ꢀ
rise
ꢀ
to
ꢀ
accidents
ꢀ  
or
ꢀ
events
ꢀ
that
ꢀ
could
ꢀ
endanger
ꢀ
human
ꢀ
lives
ꢀ
that
ꢀ
could
ꢀ
give
ꢀ
rise
ꢀ
to
ꢀ
smoke
ꢀ
or
ꢀ
fire,
ꢀ
or
ꢀ
that
ꢀ
could
ꢀ
cause
ꢀ
damage
ꢀ
to
ꢀ
other
ꢀ  
property.
ꢀ
When
ꢀ
designing
ꢀ
equipment,
ꢀ
adopt
ꢀ
safety
ꢀ
measures
ꢀ
so
ꢀ
that
ꢀ
these
ꢀ
kinds
ꢀ
of
ꢀ
accidents
ꢀ
or
ꢀ
events
ꢀ
cannot
ꢀ
occur.
ꢀ
Such
ꢀ  
measures
ꢀ
include
ꢀ
but
ꢀ
are
ꢀ
not
ꢀ
limited
ꢀ
to
ꢀ
protective
ꢀ
circuits
ꢀ
and
ꢀ
error
ꢀ
prevention
ꢀ
circuits
ꢀ
for
ꢀ
safe
ꢀ
design,
ꢀ
redundant
ꢀ
design,
ꢀ  
and
ꢀ
structural
ꢀ
design.
ꢀ  
5,In
ꢀ
the
ꢀ
event
ꢀ
that
ꢀ
any
ꢀ
or
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products(including
ꢀ
technical
ꢀ
data,
ꢀ
services)
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein
ꢀ
are
ꢀ  
controlled
ꢀ
under
ꢀ
any
ꢀ
of
ꢀ
applicable
ꢀ
local
ꢀ
export
ꢀ
control
ꢀ
laws
ꢀ
and
ꢀ
regulations,
ꢀ
such
ꢀ
products
ꢀ
must
ꢀ
not
ꢀ
be
ꢀ
exported
ꢀ
without
ꢀ  
obtaining
ꢀ
the
ꢀ
export
ꢀ
license
ꢀ
from
ꢀ
the
ꢀ
authorities
ꢀ
concerned
ꢀ
in
ꢀ
accordance
ꢀ
with
ꢀ
the
ꢀ
above
ꢀ
law.
ꢀ  
6,
ꢀ
No
ꢀ
part
ꢀ
of
ꢀ
this
ꢀ
publication
ꢀ
may
ꢀ
be
ꢀ
reproduced
ꢀ
or
ꢀ
transmitted
ꢀ
in
ꢀ
any
ꢀ
form
ꢀ
or
ꢀ
by
ꢀ
any
ꢀ
means,
ꢀ
electronic
ꢀ
or
ꢀ
mechanical,
ꢀ  
including
ꢀ
photocopying
ꢀ
and
ꢀ
recording,
ꢀ
or
ꢀ
any
ꢀ
information
ꢀ
storage
ꢀ
or
ꢀ
retrieval
ꢀ
system,
ꢀ
or
ꢀ
otherwise,
ꢀ
without
ꢀ
the
ꢀ
prior
ꢀ  
written
ꢀ
permission
ꢀ
of
ꢀ
Winsok
ꢀ
power
ꢀ
Semiconductor
ꢀ
CO.,
ꢀ
LTD.
ꢀ  
7,
ꢀ
Information
ꢀ
(including
ꢀ
circuit
ꢀ
diagrams
ꢀ
and
ꢀ
circuit
ꢀ
parameters)
ꢀ
herein
ꢀ
is
ꢀ
for
ꢀ
example
ꢀ
only;
ꢀ
it
ꢀ
is
ꢀ
not
ꢀ
guaranteed
ꢀ
for
ꢀ  
volume
ꢀ
production. Winsok
ꢀ
power
ꢀ
believes
ꢀ
information
ꢀ
herein
ꢀ
is
ꢀ
accurate
ꢀ
and
ꢀ
reliable,
ꢀ
but
ꢀ
no
ꢀ
guarantees
ꢀ
are
ꢀ
made
ꢀ
or
ꢀ  
implied
ꢀ
regarding
ꢀ
its
ꢀ
use
ꢀ
or
ꢀ
any
ꢀ
infringements
ꢀ
of
ꢀ
intellectual
ꢀ
property
ꢀ
rights
ꢀ
or
ꢀ
other
ꢀ
rights
ꢀ
of
ꢀ
third
ꢀ
parties.
ꢀ  
8,
ꢀ
Any
ꢀ
and
ꢀ
all
ꢀ
information
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein
ꢀ
are
ꢀ
subject
ꢀ
to
ꢀ
change
ꢀ
without
ꢀ
notice
ꢀ
due
ꢀ
to
ꢀ
product/technology
ꢀ  
improvement,etc.
ꢀ
When
ꢀ
designing
ꢀ
equipment,
ꢀ
refer
ꢀ
to
ꢀ
the
ꢀ
“Delivery
ꢀ
Specification”
ꢀ
for
ꢀ
the
ꢀ
Winsok
ꢀ
power
ꢀ
product
ꢀ
that
ꢀ
you
ꢀ ꢀ  
Intend
ꢀ
to
ꢀ
use.
ꢀ  
9,
ꢀ
this
ꢀ
catalog
ꢀ
provides
ꢀ
information
ꢀ
as
ꢀ
of
ꢀ
Sep.2014. Specifications
ꢀ
and
ꢀ
information
ꢀ
herein
ꢀ
are
ꢀ
subject
ꢀ
to
ꢀ
change
ꢀ
without
ꢀ  
notice.
ꢀ