Winsok-Semicon-WSP4409A

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Winsok-Semicon-WSP4409A
WSP4409A  
P-Ch MOSFET  
General Description  
Product Summery  
The
WSP4409A
is the highest  
BVDSS  
RDSON  
ID  
performance trench
P-Ch MOSFET
with  
extreme high cell density ,
 
which provide  
excellent RDSON and gate charge
 
for  
most of the synchronous buck converter  
applications .  
-1
5
A  
-30V  
8
.0
m
Ω
 
Applications  
The
WSP4409A
meet the RoHS and  
Green Product
 
requirement , 100% EAS  
guaranteed with full
 
function reliability  
approved.  
z
Power Management in Notebook Computer,  
Portable Equipment and Battery Powered Systems.  
HBM ESD protection level pass 8KV.  
Features  
SOP
–
8 Pin Configuration  
z
Advanced high cell density Trench technology  
z
Super Low Gate Charge  
z
Excellent CdV/dt effect decline  
z
100% EAS Guaranteed  
z
Green Device Available  
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
-30  
Units  
V
Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
Continuous Drain Current, V

GS

@ -10V

1  

Continuous Drain Current, V

GS

@ -10V

1  

V

GS  

±
2
0
 
-1
5
 
V
A
I

D

@T

c

=25
℃  
–
1
0  
A
I

D

@T

c

=70
℃  
Pulsed Drain Current

2  

Single Pulse Avalanche Energy

3  

Avalanche Current  
I

DM  

–
7
0  
7
0  
A
EAS  
mJ  
A
–
38  
I

AS  

P

D

@T

A

=25
℃  
T

STG  

Total Power Dissipation

4  

2.5  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
R

θ
JA  

Parameter  
Typ.  
—  
Max.  
62.5  
24  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-Ambient

1  

Thermal Resistance Junction-Case

1  

R

θ
JC  

—  
Rev
1.0
Apr.20
21  
Page 1  

WSP4409A  
P-Ch MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=-250uA  
Min.  
-30  
—  
Typ.  
—  
Max.  
—  
Unit  
V
BV

DSS  

Drain-Source Breakdown Voltage  
BV

DSS

Temperature Coefficient  
△
BV

DSS

/△
T

J  

Reference to 25
℃
, I

D

=-1mA  
V

GS

=-10V , I

D

=-1
5
A  
-0.018  
8
—  
V/
℃  
10  
—  
R

DS(ON)  

Static Drain-Source On-Resistance

2  

m
Ω
 
14  
10  
V

GS

=-4.5V , I

D

=-
10
A  
—  
V

GS(th)  

Gate Threshold Voltage  
-1.
0  
—  
-2.
7  
—  
V
–
V

GS

=V

DS

, I

D

=-250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
5.04  
—  
mV/
℃  
V

DS

=-24V , V

GS

=0V , T

J

=25
℃  
V

DS

=-24V , V

GS

=0V , T

J

=55
℃  
—  
-1  
I

DSS  

Drain-Source Leakage Current  
uA  
—  
—  
-5  
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
—  
—  
±
100  
—  
nA  
S
15  
V

DS

=-5V , I

D

=-10A  
—  
—  
Q

g  

—  
72  
12  
16  
—  
V

DS

=-15V
,
V

GS

=-4.5V
,
I

D

=-1
5
A  
nC  
Q

gs  

Q

gd  

T

d(on)  

T

r  

—  
—  
—  
Turn-On Delay Time  
Rise Time  
—  
16  
21  
—  
—  
—  
V

DD

=-15V
,
V

GS

=-10V
,
R

G

=
6
Ω
,  
I

D

=-
1
A
,RL=15Ω  
—  
ns  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
—  
80  
14  
—  
—  
—  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
—  
3500  
635  
645  
V

DS

=-15V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
—  
—  
Guaranteed Avalanche Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
EAS  
Single Pulse Avalanche Energy

5  

V

DD

=-25V , L=0.
5
mH , I

AS

=-
38
A  
30  
—  
—  
mJ  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
—  
Typ.  
—  
Max.  
–
4.0  
–
7
0  
-1.
3  
—  
Unit  
A
I

S  

I

SM  

V

SD  

t

rr  

Continuous Source Current

1,6  

Pulsed Source Current

2,6  

Diode Forward Voltage

2  

Reverse Recovery Time  
Reverse Recovery Charge  
V

G

=V

D

=0V , Force Current  
—  
—  
A
V

GS

=0V , I

S

=-1A , T

J

=25
℃  
—  
—  
V
2
6  
—  
nS  
nC  
I
F
=-1
7.6
A
,
dI/dt=100A/µs
,
T

J

=25
℃  
Q

rr  

—  
1
8  
—  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper
, t<10sec
.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is VDD=-25V,VGS=-10V,L=0.5mH,IAS=-
38
A  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The Min. value is 100% EAS tested guarantee.  
The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
6.  
Rev1.0 Apr.2021  
Page 2  

WSP4409A  
P-Ch MOSFET  
Typical Characteristics  
On Region Characteristics  
RDSON vs
V
G
S  
30  
20  
10  
0
80  
60  
40  
ID=-15A  
125C  
25C  
20  
0
0
1
4
5
-VDS(V)  
-VGS(V)  
V T
H
v
s Tj  
RDSON vs
I
D  
1.8  
18  
12  
1.2  
6
0
0.6  
0
0
3
6
-50 -10 30  
70  
110 150  
-ID(A)  
Tj-Junction Temperature(C)  
Gate Charge  
RDSON vs Tj  
12  
8
1.8  
1.2  
4
0
0.6  
0
0
8
-50 -10 30  
70  
110 150  
Qg-Gate Charge(nC)  
Tj-Junction Temperature(C)  
Rev1.0 Apr.2021  
Page 3  

WSP4409A  
P-Ch MOSFET  
Source Drain Diode Forward  
Capacitance  
3000  
2500  
10  
1.0  
0.1  
125C  
2000  
1500  
25C  
1000  
500  
0
0
0.3  
0.  
0
1
3
-VSD-Source Drain Voltage(V)  
-VDS-Drain Source Voltage(V)  
Drain Current
@
T
j  
Power Dissipation
@
T
j  
3.6  
3.0  
12  
10  
8.0  
6.0  
2.4  
1.8  
4.0  
2.0  
0
1.2  
0.6  
0
0
25  
5
0
25  
5
Tj-Junction Temperature  
Tj-Junction Temperature  
ꢀ
Thermal Transient Impedance  
10  
1
ꢀ
In  
Descending order  
D=0.5, 0.3, 0.1,0.05,0.02,0.01  
Single Pulse  
0.1  
0.01  
0.001  
1
10  
100  
1000  
0.0001  
0.001  
0.01  
0.1  
Rev1.0 Apr.2021  
Page
4  

Attention
ꢀ
 
1,
ꢀ
Any
ꢀ
and
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein
ꢀ
do
ꢀ
not
ꢀ
have
ꢀ
specifications
ꢀ
that
ꢀ
can
ꢀ
handle
ꢀ  
applications
ꢀ
that
ꢀ
require
ꢀ
extremely
ꢀ
high
ꢀ
levels
ꢀ
of
ꢀ
reliability,
ꢀ
such
ꢀ
as
ꢀ
life
Ͳ
support
ꢀ
systems,
ꢀ
aircraft’s
ꢀ
control
ꢀ
systems,
ꢀ
or
ꢀ  
other
ꢀ
applications
ꢀ
whose
ꢀ
failure
ꢀ
can
ꢀ
be
ꢀ
reasonably
ꢀ
expected
ꢀ
to
ꢀ
result
ꢀ
in
ꢀ
serious
ꢀ
physical
ꢀ
and/or
ꢀ
material
ꢀ
damage.
ꢀ ꢀ  
Consult
ꢀ
with
ꢀ
your
ꢀ
Winsok
ꢀ
power
ꢀ
representative
ꢀ
nearest
ꢀ
you
ꢀ
before
ꢀ
using
ꢀ
any
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ  
contained
ꢀ
herein
ꢀ
in
ꢀ
such
ꢀ
applications.
ꢀ  
2,Winsok
ꢀ
power
ꢀ
assumes
ꢀ
no
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responsibility
ꢀ
for
ꢀ
equipment
ꢀ
failures
ꢀ
that
ꢀ
result
ꢀ
from
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using
ꢀ
products
ꢀ
at
ꢀ
values
ꢀ
that
ꢀ
exceed,
ꢀ ꢀ  
even
ꢀ
momentarily,
ꢀ
rated
ꢀ
values
ꢀ
(such
ꢀ
as
ꢀ
maximum
ꢀ
ratings,
ꢀ
operating
ꢀ
condition
ꢀ
ranges,
ꢀ
or
ꢀ
other
ꢀ
parameters)
ꢀ
listed
ꢀ
in
ꢀ  
products
ꢀ
specifications
ꢀ
of
ꢀ
any
ꢀ
and
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products
ꢀ
described
ꢀ
or
ꢀ
contained
ꢀ
herein.
ꢀ  
3,
ꢀ
Specifications
ꢀ
of
ꢀ
any
ꢀ
and
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products
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described
ꢀ
or
ꢀ
contained
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herein
ꢀ
stipulate
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the
ꢀ
performance,
ꢀ  
characteristics,
ꢀ
and
ꢀ
functions
ꢀ
of
ꢀ
the
ꢀ
described
ꢀ
products
ꢀ
in
ꢀ
the
ꢀ
independent
ꢀ
state,
ꢀ
and
ꢀ
are
ꢀ
not
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guarantees
ꢀ
of
ꢀ
the
ꢀ  
performance,
ꢀ
characteristics,
ꢀ
and
ꢀ
functions
ꢀ
of
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the
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described
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products
ꢀ
as
ꢀ
mounted
ꢀ
in
ꢀ
the
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customer’s
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products
ꢀ
or
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equipment.
ꢀ
T
o
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verify
ꢀ
symptoms
ꢀ
and
ꢀ
states
ꢀ
that
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cannot
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be
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evaluated
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in
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an
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independent
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device,
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the
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customer
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should
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always
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evaluate
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and
ꢀ
test
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devices
ꢀ
mounted
ꢀ
in
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the
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customer’s
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products
ꢀ
or
ꢀ
equipment.
ꢀ  
4,
ꢀ
Winsok
ꢀ
power
ꢀ
Semiconductor
ꢀ
CO.,
ꢀ
LTD.
ꢀ
strives
ꢀ
to
ꢀ
supply
ꢀ
high
Ͳ
quality
ꢀ
high
Ͳ
reliability
ꢀ
products.
ꢀ
However,
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any
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and
ꢀ
all
ꢀ  
semiconductor
ꢀ
products
ꢀ
fail
ꢀ
with
ꢀ
some
ꢀ
probability.
ꢀ
It
ꢀ
is
ꢀ
possible
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that
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these
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probabilistic
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failures
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could
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give
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rise
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to
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accidents
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or
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events
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that
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could
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endanger
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human
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lives
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that
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could
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give
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rise
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to
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smoke
ꢀ
or
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fire,
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or
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that
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could
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cause
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damage
ꢀ
to
ꢀ
other
ꢀ  
property.
ꢀ
When
ꢀ
designing
ꢀ
equipment,
ꢀ
adopt
ꢀ
safety
ꢀ
measures
ꢀ
so
ꢀ
that
ꢀ
these
ꢀ
kinds
ꢀ
of
ꢀ
accidents
ꢀ
or
ꢀ
events
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cannot
ꢀ
occur.
ꢀ
Such
ꢀ  
measures
ꢀ
include
ꢀ
but
ꢀ
are
ꢀ
not
ꢀ
limited
ꢀ
to
ꢀ
protective
ꢀ
circuits
ꢀ
and
ꢀ
error
ꢀ
prevention
ꢀ
circuits
ꢀ
for
ꢀ
safe
ꢀ
design,
ꢀ
redundant
ꢀ
design,
ꢀ  
and
ꢀ
structural
ꢀ
design.
ꢀ  
5,In
ꢀ
the
ꢀ
event
ꢀ
that
ꢀ
any
ꢀ
or
ꢀ
all
ꢀ
Winsok
ꢀ
power
ꢀ
products(including
ꢀ
technical
ꢀ
data,
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services)
ꢀ
described
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or
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contained
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herein
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are
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controlled
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under
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any
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of
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applicable
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local
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export
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control
ꢀ
laws
ꢀ
and
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regulations,
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such
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products
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must
ꢀ
not
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be
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exported
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without
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obtaining
ꢀ
the
ꢀ
export
ꢀ
license
ꢀ
from
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the
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authorities
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concerned
ꢀ
in
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accordance
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with
ꢀ
the
ꢀ
above
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law.
ꢀ  
6,
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No
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part
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of
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this
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publication
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may
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be
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reproduced
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transmitted
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in
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form
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or
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by
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means,
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or
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including
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or
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retrieval
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prior
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written
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permission
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of
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Winsok
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power
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Semiconductor
ꢀ
CO.,
ꢀ
LTD.
ꢀ  
7,
ꢀ
Information
ꢀ
(including
ꢀ
circuit
ꢀ
diagrams
ꢀ
and
ꢀ
circuit
ꢀ
parameters)
ꢀ
herein
ꢀ
is
ꢀ
for
ꢀ
example
ꢀ
only;
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it
ꢀ
is
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not
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guaranteed
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for
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volume
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production. Winsok
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believes
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information
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herein
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is
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accurate
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reliable,
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but
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no
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are
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made
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or
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implied
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regarding
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its
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use
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or
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any
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of
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rights
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or
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other
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rights
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of
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third
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parties.
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8,
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Any
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and
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all
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information
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described
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or
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contained
ꢀ
herein
ꢀ
are
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subject
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to
ꢀ
change
ꢀ
without
ꢀ
notice
ꢀ
due
ꢀ
to
ꢀ
product/technology
ꢀ  
improvement,etc.
ꢀ
When
ꢀ
designing
ꢀ
equipment,
ꢀ
refer
ꢀ
to
ꢀ
the
ꢀ
“Delivery
ꢀ
Specification”
ꢀ
for
ꢀ
the
ꢀ
Winsok
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power
ꢀ
product
ꢀ
that
ꢀ
you
ꢀ ꢀ  
Intend
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to
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use.
ꢀ  
9,
ꢀ
this
ꢀ
catalog
ꢀ
provides
ꢀ
information
ꢀ
as
ꢀ
of
ꢀ
Sep.2014. Specifications
ꢀ
and
ꢀ
information
ꢀ
herein
ꢀ
are
ꢀ
subject
ꢀ
to
ꢀ
change
ꢀ
without
ꢀ  
notice.
ꢀ