Winsok-Semicon-WSR70P10D

Part #Winsok-Semicon-WSR70P10D
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Winsok-Semicon-WSR70P10D
WSR70P10D  
P-Ch MOSFET  
General Description  
Product Summery  
The
WSR70P10D
is the highest performance  
trench P-Ch MOSFET with extreme high cell  
density ,
 
which provide excellent R

DSON

and gate  
charge for
 
most of the small power switching  
and load
 
switch applications.  
BV

DSS  

R

DSON  

I

D  

-100V  
1
9
mΩ  
-70A  
Applications  
The
WSR70P10D
meet the RoHS and  
Green Product
 
requirement with full  
function reliability approved.  
z
Inverters  
TO-220
AB
Pin Configuration  
Features  
z
Advanced high cell density Trench technology  
z
Super Low Gate Charge  
z
Excellent Cdv/dt effect decline  
z
Green Device Available  
Absolute Maximum Ratings  
Rating  
Parameter  
Symbol  
Unit  
Common Ratings
(T

C

=25°C Unless Otherwise Noted)  
V

DSS  

V

GSS  

T

J  

Drain-Source Voltage  
-100  
±25  
V
Gate-Source Voltage  
Maximum Junction Temperature  
Storage Temperature Range  
Diode Continuous Forward Current  
175  
°C  
°C  
A
T

STG  

I

S  

-55 to 175  
-70  
T

C

=25°C  
Mounted on Large Heat Sink  
①
300μs Pulse Drain Current Tested  
T

C

=25°C  
T

C

=25°C  
T

C

=100°C  
T

C

=25°C  
T

C

=100°C  
-240  
–
7
0  
-4
5  
1
90  
9
5  
A
A
I

DP  

②
Continuous Drain Current(V

GS

=-10V)  
Maximum Power Dissipation  
I

D  

P

D  

W
Thermal Resistance-Junction to Case  
Thermal Resistance-Junction to Ambient  
R

θ
JC  

R

θ
JA  

0.8  
°C/W  
°C/W  
62.5  
Drain-Source Avalanche Ratings  
③
Avalanche Energy, Single Pulsed  
400  
mJ  
E

AS  

Rev1.0 Mar.2022  
Page 1  

WSR70P10D  
P-Ch MOSFET  
Electrical Characteristics
(T

C

=25°C Unless Otherwise Noted)  
Symbol  
Parameter  
Test Condition  
Min.  
Typ.  
Max.  
Unit  
Static Characteristics  
V

GS

=0V, I

DS

=-250µA  
V

DS

=-100V, V

GS

=0V  
BV

DSS  

Drain-Source Breakdown Voltage  
-100  
V
-1  
-30  
I

DSS  

Zero Gate Voltage Drain Current  
µA  
T

J

=125°C  
V

DS

=V

GS

, I

DS

=-250µA  
V

GS

=±25V, V

DS

=0V  
V

GS

=-10V, I

DS

=-
2
0A  
V

GS(th)  

I

GSS  

-1.6  
19  
–
1.2  
Gate Threshold Voltage  
–
2.5  
±100  
25  
V
Gate Leakage Current  
nA  
mΩ  
④
R

DS(ON)  

Drain-Source On-state Resistance  
Diode Characteristics  
④
I

SD

=-30A, V

GS

=0V  
Diode Forward Voltage  
-1.
2  
V
V

SD  

t
rr  
Reverse Recovery Time  
208  
560  
ns  
nC  
I
SD
=-
5
A, dl
SD
/dt=100A/µs  
Q
rr  
Reverse Recovery Charge  
⑤
Dynamic Characteristics  
V

GS

=0V,V

DS

=0V,F=1MHz  
R

G  

C

iss  

C

oss  

C

rss  

t

d(ON)  

t

r  

Gate Resistance  
2
4230  
388  
26  
Ω
Input Capacitance  
V

GS

=0V,  
V

DS

=-50V,  
Frequency=1.0MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
26  
78  
V

DD

=-50V,I

DS

=-
5
A,  
ns  
V

GEN

=-10V,R

G

=6Ω  
t

d(OFF)  

t

f  

200  
210  
Turn-off Fall Time  
⑤
Gate Charge Characteristics  
Q

g  

Q

gs  

Q

gd  

Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
80  
V

DS

=-
50
V, V

GS

=-10V,  
I

DS

=-
5
A  
nC  
15.6  
17.2  
①
Pulse width limited by safe operating area.  
Notes:  
②
Calculated continuous current based on maximum allowable
 
junction temperature.  
③
Limited by T

Jmax

, I

AS

=-40A, V

DD

=-60V, R

G

= 50Ω, Starting T

J

= 25
°
C.  
④
Pulse test;Pulse width
≤
300µs, duty cycle
≤
2%.  
⑤
Guaranteed by design, not subject to production testing.  
Rev1.0 Mar.2022  
Page
2  

WSR70P10D  
P-Ch MOSFET  
Typical Characteristics  
Output Characteristics  
Drain-Source On Resistance  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
-10V  
-8V  
-6V  
-5V  
-10V  
60  
-3V  
0
1
2
3
4
5
0
30  
90  
120  
-V

DS

– Drain-Source Voltage (V)  
-I

D

– Drain Current (A)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
100  
10  
1
V

GS

=-10V  
I

D

=-60A  
T

J

=175°C  
T

J

=25°C  
T

J

=25°C  
Rds(on)=1
9
m
Ω  
0.1  
0.3  
0.6  
0.9  
1.2  
1.5  
1.8  
-50  
-25  
0
25  
50  
75  
100 125 150  
-V

SD

– Source-Drain Voltage (V)  
T

J

– Junction Temperature (
°
C)  
Gate Charge  
Capacitance  
10  
9
8
7
6
5
4
3
2
1
0
6000  
4500  
3000  
1500  
0
VDS=-80V  
IDS=-60A  
Frequency=1.0MHz  
Ciss  
Coss  
Crss  
1
10  
100  
0
20  
40  
70  
100  
-V

DS

– Drain-Source Voltage (V)  
Q

G

– Gate Charge (nC)  
Rev1.0 Mar.2022  
Page
3  

WSR70P10D  
P-Ch MOSFET  
Typical Characteristics  
Drain Current  
Power Dissipation  
70  
60  
50  
40  
30  
20  
10  
0
200  
180  
160  
140  
120  
100  
80  
60  
40  
20  
VGS=-10V  
25 50  
0
0
25  
50  
75  
100  
125  
150  
175  
75  
100  
125  
150  
175  
T

J

– Junction Temperature (
°
C)  
T

J

– Junction Temperature (
°
C)  
Safe Operation Area  
Drain Current  
150  
125  
100  
75  
Ids=-
2
0A  
100  
10  
10µs  
100µs  
1ms  
DC  
10ms  
1
50  
0.1  
0.01  
25  
T

C

=25°C  
0.01 0.1  
0
0
1
2
3
4
5
6
7
8
9
10  
1
10  
100  
-V

GS

– Gate-Source Voltage (V)  
-V

DS

– Drain-Source Voltage (V)  
Thermal Transient Impedance  
10  
1
Duty=0.5, 0.2, 0.1, 0.05, 0.02, 0.01, Single Pulse  
0.1  
Single Pulse  
0.01  
R

θ
JC

=
0.8°C/W  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Square Wave Pulse Duration (sec)  
Rev1.0 Mar.2022  
Page
4  

Attention
ꢀ
 
1,
ꢀ
Any
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and
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all
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Winsok
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products
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described
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or
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contained
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herein
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do
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not
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have
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specifications
ꢀ
that
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can
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handle
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applications
ꢀ
that
ꢀ
require
ꢀ
extremely
ꢀ
high
ꢀ
levels
ꢀ
of
ꢀ
reliability,
ꢀ
such
ꢀ
as
ꢀ
life
Ͳ
support
ꢀ
systems,
ꢀ
aircraft’s
ꢀ
control
ꢀ
systems,
ꢀ
or
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other
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applications
ꢀ
whose
ꢀ
failure
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can
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be
ꢀ
reasonably
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expected
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to
ꢀ
result
ꢀ
in
ꢀ
serious
ꢀ
physical
ꢀ
and/or
ꢀ
material
ꢀ
damage.
ꢀ ꢀ  
Consult
ꢀ
with
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your
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Winsok
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power
ꢀ
representative
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nearest
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you
ꢀ
before
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using
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any
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Winsok
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power
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products
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described
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or
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contained
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herein
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in
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such
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applications.
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assumes
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for
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failures
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that
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result
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from
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using
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at
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values
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that
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exceed,
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even
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momentarily,
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rated
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values
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(such
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as
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maximum
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ratings,
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operating
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condition
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ranges,
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or
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other
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parameters)
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listed
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in
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products
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specifications
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of
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any
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and
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all
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Winsok
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power
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products
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described
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or
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contained
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herein.
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Specifications
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of
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any
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and
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all
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described
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contained
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herein
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stipulate
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the
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performance,
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characteristics,
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and
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functions
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of
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the
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described
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products
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in
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the
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independent
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state,
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and
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are
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not
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guarantees
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of
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the
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performance,
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characteristics,
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and
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functions
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of
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the
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described
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as
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mounted
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in
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the
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customer’s
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products
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or
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equipment.
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T
o
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verify
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symptoms
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and
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states
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that
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be
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evaluated
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in
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an
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independent
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device,
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the
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customer
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should
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always
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evaluate
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and
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test
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devices
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mounted
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in
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the
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customer’s
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or
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equipment.
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4,
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Winsok
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power
ꢀ
Semiconductor
ꢀ
CO.,
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LTD.
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strives
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to
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Ͳ
quality
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reliability
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However,
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any
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all
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semiconductor
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fail
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with
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It
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is
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that
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these
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probabilistic
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to
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or
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human
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lives
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smoke
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fire,
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or
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that
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could
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cause
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damage
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to
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other
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property.
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When
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designing
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equipment,
ꢀ
adopt
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safety
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measures
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so
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that
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these
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kinds
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of
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accidents
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or
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events
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cannot
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Such
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measures
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include
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but
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are
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not
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limited
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to
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protective
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circuits
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and
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error
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prevention
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circuits
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for
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safe
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design,
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redundant
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design,
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and
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structural
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design.
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5,In
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that
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any
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all
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are
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applicable
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obtaining
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export
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license
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from
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the
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concerned
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in
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accordance
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with
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above
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law.
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Semiconductor
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7,
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Information
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(including
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circuit
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diagrams
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and
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circuit
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parameters)
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herein
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for
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example
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volume
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and
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information
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described
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or
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contained
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herein
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are
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subject
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to
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change
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without
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notice
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due
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to
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product/technology
ꢀ  
improvement,etc.
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When
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designing
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equipment,
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refer
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to
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the
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“Delivery
ꢀ
Specification”
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for
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the
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Winsok
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product
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that
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you
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Intend
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to
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use.
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9,
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this
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catalog
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provides
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information
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as
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of
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Sep.2014. Specifications
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and
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information
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herein
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are
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subject
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to
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change
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without
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notice.
ꢀ