Winsok-Semicon-WST2301

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Winsok-Semicon-WST2301
WST2301  
P-Ch MOSFET  
General Description  
Product Summery  
The
WST2301
is the highest performance trench  
P-ch MOSFET with extreme high cell density ,  
which provide excellent RDSON and gate  
charge for
 
most of the small power switching  
and load
 
switch applications.  
BVDSS  
RDSON  
1
00
m
Ω
 
ID  
-20V  
-2.
9
A  
Applications  
The
WST2301
meet the RoHS and Green  
Product requirement
 
with full function  
reliability approved.  
z
High Frequency Point-of-Load Synchronous s  
Small power switching for MB/NB/UMPC/VGA  
z
Networking DC-DC Power System  
z
Load Switch  
Features  
SOT
–
23
N
Pin Configuration  
z
Advanced high cell density Trench technology  
z
Super Low Gate Charge  
z
Excellent Cdv/dt effect decline  
z
Green Device Available  
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
Units  
V
Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
-20  
±
12  
V

GS  

V
Continuous Drain Current, V

GS

@ -4.5V

1  

Continuous Drain Current, V

GS

@ -4.5V

1  

Pulsed Drain Current

2  

-2.
9
 
-1.9  
A
I

D

@T

c

=25
℃  
I

D

@T

c

=70
℃  
I

DM  

A
-10  
A
P

D

@T

A

=25
℃  
T

STG  

Total Power Dissipation

3  

1
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
R

θ
JA  

Parameter  
Typ.  
—  
Max.  
125  
80  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient

1  

Thermal Resistance Junction-Case

1  

R

θ
JC  

—  
Dec.2014  
Page 1  

WST2301  
P-Ch MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=-250uA  
Reference to 25
℃
, I

D

=-1mA  

GS

=-4.5V , I

D

=-2A  
Min.  
-20  
—  
Typ.  
—  
Max.  
—  
Unit  
V
BV

DSS  

Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
△
BV

DSS

/△
T

J  

-0.016  
10
0
 
—  
V/
℃  
V
—  
130  
170  
220  
-1  
R

DS(ON)  

Static Drain-Source On-Resistance

2  

m
Ω
 
V

GS

=-2.5V , I

D

=-1A  
V

GS

=-1.8V , I

D

=-1.5A  
—  
145  
185  
-0.5  
3.97  
—  
V

GS(th)  

Gate Threshold Voltage  
-0.3  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
V
V

GS

=V

DS

, I

D

=-250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
—  
mV/
℃  
V

DS

=-16V , V

GS

=0V , T

J

=25
℃  
V

DS

=-16V , V

GS

=0V , T

J

=55
℃  
-1  
I

DSS  

Drain-Source Leakage Current  
uA  
—  
-5  
V

GS

=
±
8V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
nA  
S
V

DS

=-5V , I

D

=-2A  
5.9  
13.1  
5.6  
0.72  
1.45  
4
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
26.2  
7.8  
1.0  
2.0  
8.0  
46  
Ω
Q

g  

Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
V

DS

=-15V , V

GS

=-4.5V , I

D

=-2A  
nC  
ns  
Q

gs  

Q

gd  

T

d(on)  

T

r  

V

DD

=-15V , V

GS

=-4.5V , R

G

=3.3
Ω  
25.6  
26  
I

D

=-2A  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
52  
12.4  
332  
48  
24.8  
465  
67  
C

iss  

C

oss  

C

rss  

Input Capacitance  
V

DS

=-15V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
42  
59  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
—  
Typ.  
—  
Max.  
-2.4  
-10  
-1.2  
—  
Unit  
A
I

S  

I

SM  

V

SD  

t

rr  

Continuous Source Current

1,4  

Pulsed Source Current

2,4  

Diode Forward Voltage

2  

Reverse Recovery Time  
Reverse Recovery Charge  
V

G

=V

D

=0V , Force Current  
—  
—  
A
V

GS

=0V , I

S

=-1A , T

J

=25
℃  
—  
—  
V
—  
23  
nS  
nC  
I
F
=-2A , dI/dt=100A/µs , T

J

=25
℃  
Q

rr  

—  
4.7  
—  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper
,t<10sec
.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature  
4.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
Dec.2014  
Page
2  

WST2301  
P-Ch MOSFET  
Typical Characteristics  
280  
240  
200  
160  
120  
80  
10  
9
8
7
6
5
4
3
2
1
0
I

D

=-2A  
V

GS

=-5V  
V

GS

=-4.5V  
V

GS

=-3V  
V

GS

=-2.5V  
V

GS

=-1.8V  
2
4
6
8
10  
0
0.5  
1
1.5  
2
-V

GS

(V)  
-V

DS

, Drain-to-Source Voltage (V)  
Fig.2 On-Resistance vs. Gate-Source  
Fig.1 Typical Output Characteristics  
5
4
3
2
T =150  
T =25  
℃
J
℃
J
1
0
0
0.3  
0.6  
0.9  
1.2  
-V

SD

, Source-to-Drain Voltage (V)  
Fig.3 Forward Characteristics Of Reverse  
Fig.4 Gate-Charge Characteristics  
1.8  
1.4  
1.0  
0.6  
0.2  
1.8  
1.4  
1
0.6  
0.2  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T ,Junction
 
Temperature (  
J
)
T ,
 
Junction Temperature (  
J
)
℃
℃
Fig.5 Normalized V

GS(th)

vs. T

J  

Fig.6 Normalized R

DSON

vs. T

J  

Dec.2014  
Page
3  

WST2301  
P-Ch MOSFET  
1000  
100  
10  
100.00  
10.00  
1.00  
F=1.0MHz  
Ciss  
100us  
10ms  
100ms  
Coss  
Crss  
1s  
0.10  
DC  
T =25  
℃
A
Single Pulse  
0.01  
1
5
9
13  
17  
21  
0.1  
1
10  
100  
-V

DS

(V)  
-V

DS

, Drain to Source Voltage (V)  
Fig.8 Safe Operating Area  
Fig.7 Capacitance  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
0.01  
P

DM  

T

ON  

0.001 SINGLE
 
PULSE  
T
D = T

ON

/T  
T

Jpeak

= T

A

+
P

DM

x R

θ
JA  

0.0001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Fig.10 Switching Time Waveform  
Fig.11 Gate Charge Waveform  
Dec.2014  
Page
4  

Attention
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1,
ꢀ
Any
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and
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all
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Winsok
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products
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described
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or
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contained
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herein
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do
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not
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have
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specifications
ꢀ
that
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can
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handle
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applications
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that
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require
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extremely
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high
ꢀ
levels
ꢀ
of
ꢀ
reliability,
ꢀ
such
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as
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life
Ͳ
support
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systems,
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aircraft’s
ꢀ
control
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systems,
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or
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other
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applications
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whose
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failure
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can
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be
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reasonably
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expected
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to
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result
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in
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serious
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physical
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and/or
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material
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damage.
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Consult
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with
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your
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representative
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nearest
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you
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before
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Winsok
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products
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described
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or
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contained
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herein
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in
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for
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even
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rated
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values
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(such
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operating
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condition
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ranges,
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or
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other
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listed
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of
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characteristics,
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in
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of
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as
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mounted
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in
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o
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Winsok
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Semiconductor
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Ͳ
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to
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property.
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designing
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adopt
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so
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that
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these
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of
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Such
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but
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limited
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error
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for
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safe
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design,
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redundant
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design,
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and
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structural
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design.
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all
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obtaining
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due
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improvement,etc.
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When
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designing
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refer
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the
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“Delivery
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Specification”
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for
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Intend
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9,
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this
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catalog
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provides
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information
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as
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of
ꢀ
Sep.2014. Specifications
ꢀ
and
ꢀ
information
ꢀ
herein
ꢀ
are
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subject
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to
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change
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without
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notice.
ꢀ