Winsok-Semicon-WST2337A

Part #Winsok-Semicon-WST2337A
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Winsok-Semicon-WST2337A
WST2337
A
 
P-Ch MOSFET  
General Description  
Product Summery  
The
WST2337A
is the highest performance  
trench P-Ch
 
MOSFET with extreme high cell  
density ,
 
which provide excellent RDSON  
and gate charge
 
for most of the small power  
switching and load
 
switch applications.  
BVDSS  
RDSON  
30
mΩ  
ID  
–
15
V  
–
4.8
A  
Applications  
The
WST2337A
meet the RoHS  
and Green Product
 
requirement  
with full function reliability approved.  
z
High Frequency Point-of-Load Synchronous  
Small power switching for MB/NB/UMPC/VGA  
z
Networking DC-DC Power System  
z
Load Switch  
Features  
SOT
–
23
-3L
Pin Configuration  
z
Advanced high cell density Trench technology  
z
Super Low Gate Charge  
z
Excellent Cdv/dt effect decline  
z
Green Device Available  
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
–
15  
Units  
V
Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
Continuous Drain Current, V

GS

@ -4.5V

1  

Continuous Drain Current, V

GS

@ -4.5V

1  

V

GS  

±
12  
–
4.8  
–
3.
4  
–
2
4  
V
A
I

D

@T

c

=25
℃  
I

D

@T

c

=70
℃  
I

DM  

A
A
Pulsed Drain Current  
Total Power Dissipation

3  

1.4  
P

D

@T

A

=25
℃  
T

STG  

W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
R

θJA  

Parameter  
Typ.  
—  
Max.  
125  
80  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient

1  

Thermal Resistance Junction-Case

1  

R

θJC  

—  
Dec.2014  
Page 1  

WST2337A  
P-Ch MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=-250uA  
Min.  
–
1
5
 
—  
Typ.  
Max.  
Unit  
BV

DSS  

Drain-Source Breakdown Voltage  
—  
30  
45  
—  
V
48  
V

GS

=-4.5V , I

D

=-4
.1
A  
R

DS(ON)  

Static Drain-Source On-Resistance  
m
Ω
 
65  
-1.2  
-1  
V

GS

=-2.5V , I

D

=-3A  
—  
-0.
45  
—  
V

GS

=V

DS

, I

D

=-250uA  
V

GS(th)  

I

DSS  

Gate Threshold Voltage  
-0.7  
—  
V
Drain-Source Leakage Current  
V

DS

=-12V , V

GS

=0V , T

J

=25
℃  
uA  
I

GSS  

Q

g  

Gate-Source Leakage Current  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
—  
—  
±
100  
—  
V

GS

=
±
12V , V

DS

=0V  
nA  
7.8  
—  
V

DS

=-4
V
,
I

D

=-4.1A,V

GS

=-4.5V  
nC  
Q

gs  

Q

gd  

T

d(on)  

T

r  

—  
1.2  
1.6  
12  
—  
—  
—  
—  
—  
—  
35  
—  
V

DD

=-4
V
,
I

D

=-3.3A , R

L

=-  
1.2Ω,V

GEN

=-4.5
V
,
R

g

=1Ω  
ns  
30  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
—  
—  
—  
10  
7
38  
280  
190  
—  
1500  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
—  
V

DS

=-4
V
,
V

GS

=0
V
,  
F=1.0MHz  
pF  
—  
—  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
—  
Typ.  
—  
Max.  
Unit  
A
V

G

=V

D

=0V , Force Current  
–
4
.1  
I

S  

Continuous Source Current  
Diode Forward Voltage  
V

SD  

—  
—  
-1.
2  
V
V

GS

=0V , I

S

=-1
.6
A , T

J

=25
℃  
Notes:  
1.
Repetitive Rating: Pulse width limited by maximum junction temperature.  
2.
Surface Mounted on FR4 Board, t
≤
10 sec.  
3.
Pulse Test: Pulse Width
≤
300
μ
s, Duty Cycle
≤
2%.  
4.
Guaranteed by design, not subject to production  
Dec.2014  
Page
2  

WST2337A  
P-Ch MOSFET  
Typical Characteristics  
Figure 1:Switching Test Circuit  
Figure 2:Switching Waveforms  
T

J

-Junction
T
e
mperature(
℃
)  
T

J

-Junction
T
e
mperature(
℃
)  
Figure 3 Power Dissipation  
Figure 4 Drain Current  
.
Vds Drain-Source Voltage (V)  
I

D

– Drain Current (A)  
Figure 5 Output Characteristics  
Figure 6 Drain-Source On-Resistance  
Dec.2014  
Page
3  

WST2337A  
P-Ch MOSFET  
Vgs Gate-Source Voltage (V)  
T

J

-Junction
T
e
mperature(
℃
)  
Figure 7 Transfer Characteristics  
Figure 8 Drain-Source On-Resistance  
Vgs Gate-Source Voltage (V)  
Vds Drain-Source Voltage (V)  
Figure 9 Rdson vs Vgs  
Figure 10 Capacitance vs Vds  
Qg Gate Charge (nC)  
Vsd Source-Drain Voltage (V)  
Figure 11 Gate Charge  
Figure 12 Source- Drain Diode Forward  
Dec.2014  
Page
4  

WST2337A  
P-Ch MOSFET  
Vds Drain-Source Voltage (V)  
Figure 13 Safe Operation Area  
Square Wave Pluse Duration(sec)  
Figure 14 Normalized Maximum Transient Thermal Impedance  
Dec.2014  
Page
5
 

Attention
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1,
ꢀ
Any
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and
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all
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Winsok
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products
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described
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or
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contained
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herein
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do
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not
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have
ꢀ
specifications
ꢀ
that
ꢀ
can
ꢀ
handle
ꢀ  
applications
ꢀ
that
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require
ꢀ
extremely
ꢀ
high
ꢀ
levels
ꢀ
of
ꢀ
reliability,
ꢀ
such
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as
ꢀ
life
Ͳ
support
ꢀ
systems,
ꢀ
aircraft’s
ꢀ
control
ꢀ
systems,
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or
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other
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applications
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whose
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failure
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can
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be
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reasonably
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expected
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to
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result
ꢀ
in
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serious
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physical
ꢀ
and/or
ꢀ
material
ꢀ
damage.
ꢀ ꢀ  
Consult
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with
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your
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Winsok
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power
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representative
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nearest
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you
ꢀ
before
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using
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any
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Winsok
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power
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products
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described
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or
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contained
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herein
ꢀ
in
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such
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applications.
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assumes
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no
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responsibility
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for
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equipment
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failures
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that
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result
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from
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using
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products
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at
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values
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that
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exceed,
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even
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momentarily,
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rated
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values
ꢀ
(such
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as
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maximum
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ratings,
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operating
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condition
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ranges,
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or
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other
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parameters)
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listed
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in
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products
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specifications
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of
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any
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and
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all
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Winsok
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power
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products
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described
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or
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contained
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herein.
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Specifications
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of
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any
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and
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all
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products
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described
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or
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contained
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herein
ꢀ
stipulate
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the
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performance,
ꢀ  
characteristics,
ꢀ
and
ꢀ
functions
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of
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the
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described
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products
ꢀ
in
ꢀ
the
ꢀ
independent
ꢀ
state,
ꢀ
and
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are
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not
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guarantees
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of
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the
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performance,
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characteristics,
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and
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functions
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of
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the
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described
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products
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as
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mounted
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in
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the
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customer’s
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products
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or
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equipment.
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T
o
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verify
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symptoms
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and
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states
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that
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cannot
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be
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evaluated
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in
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an
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independent
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device,
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the
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customer
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should
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always
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evaluate
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and
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test
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devices
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mounted
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in
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the
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customer’s
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products
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or
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equipment.
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4,
ꢀ
Winsok
ꢀ
power
ꢀ
Semiconductor
ꢀ
CO.,
ꢀ
LTD.
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strives
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to
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supply
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high
Ͳ
quality
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high
Ͳ
reliability
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However,
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any
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and
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all
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semiconductor
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products
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fail
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with
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some
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probability.
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It
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is
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possible
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that
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these
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probabilistic
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failures
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could
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to
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or
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could
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cause
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to
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other
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property.
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When
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designing
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adopt
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safety
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measures
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so
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that
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these
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kinds
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of
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accidents
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or
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cannot
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Such
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include
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but
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are
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not
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limited
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to
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protective
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and
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error
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prevention
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circuits
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for
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safe
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design,
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redundant
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design,
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and
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structural
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design.
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that
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all
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applicable
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export
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and
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obtaining
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the
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export
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license
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from
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the
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authorities
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concerned
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in
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accordance
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with
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the
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above
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of
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Semiconductor
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Information
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(including
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circuit
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diagrams
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and
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circuit
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parameters)
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herein
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is
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for
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example
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only;
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is
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volume
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and
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all
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information
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described
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or
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contained
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herein
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are
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subject
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to
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change
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without
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notice
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due
ꢀ
to
ꢀ
product/technology
ꢀ  
improvement,etc.
ꢀ
When
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designing
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equipment,
ꢀ
refer
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to
ꢀ
the
ꢀ
“Delivery
ꢀ
Specification”
ꢀ
for
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the
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Winsok
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power
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product
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that
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you
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Intend
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to
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use.
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9,
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this
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catalog
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provides
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information
ꢀ
as
ꢀ
of
ꢀ
Sep.2014. Specifications
ꢀ
and
ꢀ
information
ꢀ
herein
ꢀ
are
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subject
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to
ꢀ
change
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without
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notice.
ꢀ