Winsok-Semicon-WST3407A
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WST3407A
P-Ch MOSFET
Product Summery
General Description
The
WST3407A
is the highest performance
trench P-ch MOSFET with extreme high cell
density , which provide excellent RDSON and
gate charge for most of the small power switching
and load switch applications.
BVDSS
RDSON
ID
-30V
75
m
Ω
–
5.
3
A
Applications
The
WST3407A
meet the RoHS and Green
Product requirement
with full function reliability
approved.
z
High Frequency Point-of-Load Synchronous
Buck Converter for MB/NB/UMPC/VGA
z
Networking DC-DC Power System
z
Load Switch
Features
SOT-23-3L
Pin Configuration
z
Advanced high cell density Trench technology
z
Super Low Gate Charge
z
Excellent CdV/dt effect decline
z
Green Device Available
Absolute Maximum Ratings
Rating
Symbol
Parameter
Units
10s
Steady State
-30
V
DS
V
GS
Drain-Source Voltage
Gate-Sou
r
ce Voltage
Continuous Drain Current, V
GS
@ -10V
1
Continuous Drain Current, V
GS
@ -10V
1
Pulsed Drain Current
2
V
V
±
20
–
20
–
6
.3
–
4
.
5
–
5
.
3
–
3.5
A
I
D
@T
C
=25
℃
I
D
@T
C
=70
℃
I
DM
A
A
P
D
@T
A
=25
℃
P
D
@T
A
=70
℃
T
STG
Total Power Dissipation
3
Total Power Dissipation
3
1.32
0.84
1
W
W
℃
℃
0.64
Storage
T
e
mperature Range
Operating Junction Temperature Range
-55 to 150
-55 to 150
T
J
Thermal Data
Symbol
R
θ
JA
Parameter
Typ.
—
Max.
Unit
℃
/W
℃
/W
℃
/W
Thermal Resistance Junction-Ambient
1
Thermal Resistance Junction-Ambient
1
(t
≤
10s)
Thermal Resistance Junction-Case
1
125
95
R
θ
JA
—
R
θ
JC
—
80
Rev:1.0 May.2019
Page 1
WST3407A
P-Ch MOSFET
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)
Symbol
Parameter
Conditions
V
GS
=0V , I
D
=-250uA
Min.
-30
—
Typ.
—
Max.
—
Unit
V
BV
DSS
Drain-Source Breakdown Voltage
BV
DSS
Temperature Coefficient
△
BV
DSS
/△
T
J
Reference to 25
℃
, I
D
=-1mA
V
GS
=-10V , I
D
=-3A
-0.023
75
—
V/
℃
—
85
115
-2.5
—
R
DS(ON)
Static Drain-Source On-Resistance
2
m
Ω
100
V
GS
=-4.5V , I
D
=-2A
—
V
GS(th)
Gate Threshold Voltage
-1.2
—
-1.
8
4
V
V
GS
=V
DS
, I
D
=-250uA
△
V
GS(th)
V
GS(th)
Temperature Coefficient
mV/
℃
V
DS
=-24V , V
GS
=0V , T
J
=25
℃
V
DS
=-24V , V
GS
=0V , T
J
=55
℃
—
—
-1
I
DSS
Drain-Source Leakage Current
uA
—
—
-5
V
GS
=
±
20V , V
DS
=0V
I
GSS
gfs
Gate-Source Leakage Current
Forward Transconductance
Total Gate Charge (-4.5V)
Gate-Source Charge
Gate-Drain Charge
—
—
±
100
—
nA
S
V
DS
=-5V , I
D
=-3A
—
11
6.4
2.3
1.9
2.8
8.4
39
6
Q
g
—
9.0
V
DS
=-15V , V
GS
=-4.5V , I
D
=-3A
nC
Q
gs
Q
gd
T
d(on)
T
r
—
3.2
—
2.7
Turn-On Delay Time
Rise Time
—
5.6
V
DD
=-15V , V
GS
=-10V , R
G
=3.3
Ω
,
—
15.1
78.0
12.0
816
140
112
ns
I
D
=-3A
T
d(off)
T
f
Turn-Off Delay Time
Fall Time
—
—
C
iss
C
oss
C
rss
Input Capacitance
—
583
100
80
V
DS
=-15V , V
GS
=0V , f=1MHz
pF
Output Capacitance
Reverse Transfer Capacitance
—
—
Diode Characteristics
Symbol
Parameter
Conditions
V
G
=V
D
=0V , Force Current
V
GS
=0V , I
S
=-1A , T
J
=25
℃
Min.
—
Typ.
—
Max.
–
2
Unit
A
I
S
I
SM
V
SD
t
rr
Continuous Source Current
1,4
Pulsed Source Current
2,4
Diode Forward Voltage
2
Reverse Recovery Time
Reverse Recovery Charge
—
—
–
20
-1
A
—
—
V
—
11
—
nS
nC
I
F
=-3A , dI/dt=100A/µs , T
J
=25
℃
Q
rr
—
5.3
—
Note :
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper
,t<10sec
.
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3.The power dissipation is limited by 150
℃
junction temperature
4.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.
Rev:1.0 May.2019
Page
2
WST3407A
P-Ch MOSFET
Typical Characteristics
165
135
105
75
I
D
=-3A
45
2
4
6
8
10
-V
GS
(V)
Fig.2 On-Resistance v.s Gate-Source
Fig.1 Typical Output Characteristics
10
8
6
T =150
T =25
℃
J
℃
J
4
2
0
0
0.2
0.4
0.6
0.8
1
-V
SD
, Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics of Reverse
Fig.4 Gate-Charge Characteristics
1.5
1.0
0.5
0.0
1.8
1.4
1.0
0.6
0.2
-50
0
50
100
150
-50
0
50
100
150
T ,Junction
Temperature (
J
)
℃
T ,
Junction Temperature (
J
)
℃
Fig.5 Normalized V
GS(th)
vs. T
J
Fig.6 Normalized R
DSON
vs T
J
Rev:1.0 May.2019
Page
3
WST3407A
P-Ch MOSFET
Fig.7 Capacitance
Fig.8 Safe Operating Area
1
0.1
DUTY=0.5
0.2
0.1
0.05
0.02
0.01
0.01
P
DM
T
ON
0.001 SINGLE
PULSE
T
D = T
ON
/T
Jpeak
= T
C
+
P
DM
x R
θ
JC
T
0.0001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
Fig.11 Gate Charge Waveform
Rev:1.0 May.2019
Page
4
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life
Ͳ
support
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aircraft’s
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control
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o
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Sep.2014. Specifications
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