Winsok-Semicon-WST6002

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Winsok-Semicon-WST6002
WST6002  
N-Ch MOSFET  
General Description  
Product Summery  
The
WST6002
is the highest performance
 
trench  
N-Ch MOSFET
with extreme high cell
 
density ,  
which provide excellent RDSON and gate
 
charge  
for most of the small power switching and
 
load  
switch applications.  
BVDSS  
RDSON  
ID  
3
0V  
5
Ω
 
1
0
0mA  
Applications  
The
WST6002
meet the RoHS and Green  
Product requirement with full function reliability  
approved.  
z
High Frequency Point-of-Load Synchronous  
Buck Converter for MB/NB/UMPC  
z
Networking DC-DC Power System  
z
Load Switch  
Features  
SOT
–
523
Pin Configuration  
z
High-speed switching  
z
Green Device Available  
z
ESD Protected:2KV  
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
30  
Units  
V
Drain-Source Voltage  
V

GS  

Gate-Sou
r
ce Voltage  
±
20  
100  
60  
V
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I

DM  

Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

Pulsed Drain Current

2  

mA  
mA  
A
0.5  
P

D

@T

A

=25
℃  
T

STG  

Total Power Dissipation

3  

0.
15  
W
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
℃
T

J  

℃
Thermal Data  
Symbol  
Parameter  
Typ.  
Max.  
Unit  
R

θ
JA  

Thermal Resistance Junction-Ambient

1  

—  
625  
℃
/W  
Dec.2014  
Page 1  

WST6002  
N-Ch MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
3
0  
—  
—  
—  
1
Typ.  
—  
Max.  
—  
Unit  
V
BV

DSS  

Drain-Source Breakdown Voltage  
BV

DSS

Temperature Coefficient  
△
BV

DSS

/△
T

J  

Reference to 25
℃
, I

D

=1mA  
V

GS

=10V , I

D

=0.
01
A  
0.05  
—  
—  
V/
℃  
5
R

DS(ON)  

Static Drain-Source On-Resistance

2  

Ω
—  
13  
V

GS

=4.5V , I

D

=0.
01
A  
V

GS(th)  

Gate Threshold Voltage  
—  
-3.7  
—  
—  
—  
45
0  
2
2.5  
—  
V
V

GS

=V

DS

, I

D

=250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
mV/
℃  
1
V

DS

=
24
V , V

GS

=0V , T

J

=25
℃  
V

DS

=
24
V , V

GS

=0V , T

J

=55
℃  
I

DSS  

Drain-Source Leakage Current  
uA  
5
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Turn-On Delay Time  
Rise Time  
±
10  
—  
uA  
V

DS

=5V , I

D

=0.
1
A  
mS  
T

d(on)  

T

r  

3.5  
2.2  
9
V

DD

=
15
V , V

GS

=10V ,  
R

G

=3.3
Ω
, I

D

=0.
1
A  
1
.0  
5
ns  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
1.5  
9
2.5  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
5
V

DS

=
15
V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
2
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
—  
Typ.  
—  
Max.  
1
0
0  
0.5  
1
Unit  
mA  
A
I

S  

Continuous Source Current

1,4  

Pulsed Source Current

2,4  

Diode Forward Voltage

2  

V

G

=V

D

=0V , Force Current  
I

SM  

V

SD  

—  
—  
—  
—  
V
V

GS

=0V , I

S

=
0.2
A , T

J

=25
℃  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature.  
4.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
Dec.2014  
Page
2  

WST6002  
N-Ch MOSFET  
Typical Characteristics  
Fig.2 On-Resistance vs. Gate-Source Voltage  
Fig.1 Typical Output Characteristics  
Fig.3 Forward Characteristics of Reverse  
Fig.4 Capacitance  
Fig.6 Normalized R

DSON

vs. T

J  

Fig.5 Normalized V

GS(th)

vs. T

J  

Dec.2014  
Page
3  

WS
T
6002  
N-Ch MOSFET  
Fig.8 Safe Operating Area  
Fig.10 Switching Time Waveform  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Dec.2014  
Page
4  

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applications
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that
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extremely
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high
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of
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reliability,
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such
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as
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life
Ͳ
support
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aircraft’s
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control
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systems,
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failure
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result
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in
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serious
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physical
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damage.
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Consult
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with
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your
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representative
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nearest
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you
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before
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ranges,
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characteristics,
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in
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as
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mounted
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customer’s
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o
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Semiconductor
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When
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“Delivery
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Specification”
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Sep.2014. Specifications
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