WPMtek-Wei-Pan-Microelectronics-MMBT3906

Part #WPMtek-Wei-Pan-Microelectronics-MMBT3906
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WPMtek-Wei-Pan-Microelectronics-MMBT3906
Integrated in  
OVP&OCP
products  
provider  
MMBT390
6
 
SOT-23 Plastic-Encapsulate Transistors  
SOT-23  
特
征
Features  
与
MMBT3904
配对
; Complementary to MMBT3904  
最大功率耗
散
200mW; Power Dissipation of 200mW  
高稳定性和可靠性。
High Stability and High Reliability  
机械数
据
Mechanical Data  
封装
: SOT-23
封
装
SOT-23 Small Outline Plastic Package  
环氧树
脂
UL
易燃等
级
Epoxy UL: 94V-0  
Marking: 2A  
安装位置
:
任
意
Mounting Position: Any  
极限值和温度特性
(
TA = 25
℃
除非另有规定
)  
Maximum Ratings & Thermal Characteristics
(
Ratings at 25
℃
ambient temperature unless otherwise specified.)  
参数
Parameters  
符
号
Symbol  
V
CBO  
V
CEO  
V
EBO  
I
C  
数
值
Value  
-40  
单
位
Unit  
Collector-Base Voltage  
V
V
Collector-Emitter Voltage  
Emitter -Base Voltage  
-40  
-5  
V
Collector Current-Continuous  
Collector Power Dissipation  
Junction
T
e
mperature  
-200  
200  
mA  
mW  
℃
P
C  
T
j  
150  
Storage
T
e
mperature  
T
s
tg  
-55-+150  
625  
℃
Thermal resistance From junction to ambient  
R
θJA  
℃
/W  
电特性
(
TA = 25
℃
除非另有规定
)  
Electrical Characteristics
(
Ratings at 25
℃
ambient temperature unless otherwise specified).  
界
限
Limits  
参数  
Parameter  
符号  
Symbols  
测试条件  
Test Condition  
单位  
Unit  
Min  
-40  
-40  
-5  
Max  
V
(BR)CBO  
V
(BR)CEO  
V
(BR)EBO  
I
CEX  
I
CBO  
I
EBO  
h
FE(1)  
h
FE(2)  
h
FE(3)  
V
CE(sat)1  
V
BE(sat)  
f
T  
Collector-base breakdown voltage  
Collector-emitter breakdown voltage  
Emitter-base breakdown voltage  
Collector cut-off current  
Collector cut-off current  
Emitter cut-off current  
I
C
=-10uA, I
E
=0  
I
C
=-1mA, I
B
=0  
I
E
=-10uA, I
C
=0  
V
CE
=-30V, V
EB(off)
=-3V  
V
CB
=-40V, I
E
=0  
V
EB
=-5V, I
C
=0  
V
CE
=-1V, I
C
=-10mA  
V
CE
=-1V, I
C
=-50mA  
V
CE
=-1V, I
C
=-100mA  
I
C
=-50mA, I
B
=-5mA  
V
V
V
nA  
nA  
nA  
-100  
-50  
-100  
300  
100  
60  
DC current gain  
30  
Collector-emitter saturation voltage  
Base -emitter saturation voltage  
Transition frequency  
-0.30  
-0.95  
V
V
MHz  
nS  
I
C
=-50mA, I
B
=-5mA  
V
CE
=-20V, I
C
=-10mA,f=100MHz  
VCC=-3V, VBE(off)=-0.5V, IC=-10mA, IB1=-1mA  
300  
t
d  
Delay time  
35  
VCC=-3V, VBE(off)=-0.5V, IC=-10mA, IB1=-1mA  
t
r  
ts  
tf  
Rise time  
Storage time  
Fall time  
35  
225  
75  
nS  
nS  
nS  
V
CC
=-3V, I
C
=-10mA, I
B1=
I
B2
=-1mA  
V
CC
=-3V, I
C
=-10mA, I
B1=
I
B2
=-1mA  
CLASSIFICATION OF h
FE(1)  
HFE  
RANK  
RANGE  
100-300  
L
H
100-200  
200-300  
Rev.A_Aug,2017  
– 1 –  

Integrated in  
OVP&OCP
products  
provider  
MMBT390
6
 
Rev.A_Aug,2017  
– 1 –  

Integrated in  
OVP&OCP
products  
provider  
MMBT390
6
 
SOT-23 PACKAGE OUTLINE
Plastic surface mounted package  
焊盘设计参考
Precautions: PCB Design  
Recommended land dimensions for SOT-23 diode. Electrode patterns for PCBs  
Rev.A_Aug,2017  
– 1 –