WPMtek-Wei-Pan-Microelectronics-WTM30N65AMP

Part #WPMtek-Wei-Pan-Microelectronics-WTM30N65AMP
Download 
WPMtek-Wei-Pan-Microelectronics-WTM30N65AMP
WTM30N65AMP  
650V N-Channel Super Junction MOSFET  
Features  
BV  

DS
S

=650V,
I

D
=30A  

•
•
•
•
•
R

DS(on)  

@
: 0.13
0
Ω
(Max)  
V

GS  

=10V  
Very Low FOM (R

DS(on)

X Q

g

)  
Extremely low switching loss  
Excellent stability and uniformity  
100% Avalanche Tested  
Built-in ESD Diode  
G
D
S
TO-247  
Application  
•
•
•
•
•
Switch Mode Power Supply (SMPS)  
Uninterruptible Power Supply (UPS)  
Power Factor Correction (PFC)  
AC to DC Converters  
Telecom, Solar  
Device Marking and Package Information  
Ordering code  
Package  
Marking  
30N65AMP
XX YY
WW  
WTM30N65AMP  
TO-247  
Absolute Maximum Ratings  
T

C

=25
℃
unless otherwise specified  
Symbol  
V

DSS  

V

GS  

Parameter  
Value  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
Drain Current  
650  
±
20  
30.0  
15.8  
80  
V
– Continuous (T

C

= 25
℃
)  
A
I

D  

Drain Current  
– Continuous (T

C

= 100
℃
)  
A
1)  
I

DM  

E

AS  

I

AR  

Drain Current  
– Pulsed  
A
2)  
Single Pulsed Avalanche Energy  
454  
mJ  
A
Avalanche Current  
3.1  
dv/dt  
MOSFET dv/dt ruggedness, VDS=0…400V  
Reverse diode dv/dt, V

DS

=0…400V, I

DS

≤I

D  

Power Dissipation (T

C

= 25
℃
)  
50  
V/ns  
V/ns  
W
dv/dt  
15  
P

D  

179  
V

ESD(G-S)  

T

J,

T

STG  

Gate source ESD(HBM-C=100pF, R=1.5K
Ω)  
Operating and Storage Temperature Range  
2000  
-55 to +150  
V
℃
Thermal Resistance
 
Characteristics  
Symbol  
R

θ
JC  

R

θ
JA  

Parameter  
Value  
0.7  
Unit  
℃
/W  
℃
/W  
Thermal Resistance,
 
Junction-to-Case, Max.  
Thermal Resistance,
 
Junction-to-Ambient , Max.  
62.5  
– 1 –  

WTM30N65AMP  
650V N-Channel Super Junction MOSFET  
Electrical Characteristics

T

J

=25
°
C unless otherwise specified  

Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
On Characteristics  
V

GS  

Gate Threshold Voltage  
V

DS

= V

GS

, I

D

= 1.1 mA  
V

GS

= 10 V, I

D

= 10.2 A  
2.0  
–
–
4.0  
V
R

DS(ON)  

115  
130  
m
Ω  
Static Drain-Source On-Resistance  
Off Characteristics  
BV

DSS  

Drain-Source Breakdown Voltage  
V

GS

= 0 V, I

D

= 1mA  
650  
–
–
–
–
–
V
V

DS

= 650 V, V

GS

= 0  
V

DS

= 650 V, T

C

= 150
℃  
V

GS

=
±
20 V, V

DS

= 0 V  
–
–
–
1
μA  
μA  
μA  
I

DSS  

Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
100  
±
1  
I

GSS  

Dynamic Characteristics  
C

iss  

C

oss  

C

rss  

Input Capacitance  
–
–
–
2840  
61  
–
–
–
pF  
pF  
pF  
V

DS

= 400 V, V

GS

= 0 V,  
f = 1.0 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
3.8  
Switching Characteristics  
t

d(on)  

t

r  

t

d(off)  

t

f  

Turn-On Time  
–
–
–
–
–
–
–
56  
31  
–
–
–
–
–
–
–
ns  
ns  
V

DS

= 325 V, I

D

= 14.3 A,  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
R

G

= 25
Ω  
250  
20  
ns  
(Note 3,4)  
ns  
Q

g  

Q

gs  

Q

gd  

65  
nC  
nC  
nC  
V

DS

= 520 V,
 
I

D

= 14.3 A,  
V

GS

= 10 V  
12  
(Note 3,4)  
19  
Drain-Source Diode Characteristics and Maximum Ratings  
I

S  

Maximum Continuous Drain-Source Diode Forward Current  
–
–
–
–
–
–
–
30  
80  
1.3  
–
A
A
I

SM  

V

SD  

trr  
Maximum Pulsed Drain-Source Diode Forward Current  
Drain-Source Diode Forward Voltage  
Reverse Recovery Time  
V

GS

= 0 V, I

S

= 14.3 A  
–
V
450  
7.8  
ns  
μC  
V

R

= 400 V, I

F

= 14.3 A  
di

F

/dt = 100 A/
μs  
Qrr  
Reverse Recovery Charge  
–
Notes :  
1. Repetitive
 
Rating : Pulse width limited by maximum junction temperature  
2. I

AS

=3.1A V

DD

=100V, R

G

=25
Ω
, Starting T

J

=25
°
C  
3. Pulse
 
Test : Pulse Width
≤ 300μs, Duty Cycle ≤ 2%  
4. Essentially
 
Independent of Operating Temperature  
– 2 –  

WTM30N65AMP  
650V N-Channel Super Junction MOSFET  
Typical Characteristics  
90  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
20V  
10V  
8V  
80  
70  
60  
50  
40  
30  
20  
10  
0
25
℃
 
7V  
150
℃  
6V  
5.5V  
5V  
※
Notes  
1. V

DS

= 20 V  
2. 300us Pulse Test  
4.5V  
0
0
0
5
10  
15  
20  
0
2
4
6
8
10  
V

DS

, Drain-Source Voltage
 
[V]  
V

GS

, Gate-Source Voltage [V]  
Figure 1. On Region Characteristics  
Figure 2. Transfer Characteristics  
0.3  
0.2  
0.1  
0.0  
1E+02  
1E+01  
1E+00  
1E-01  
1E-02  
1E-03  
1E-04  
1E-05  
V

GS

= 10V  
150
℃  
V

GS

= 20V  
25
℃  
※
Notes  
1. V

GS

= 10 V  
2. T

J

= 25
℃  
※
Notes  
1. V

GS

= 0 V  
2. 300us Pulse Test  
10  
20  
30  
40  
50  
60  
70  
80  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
I

D

[A]  
V

SD

[V]  
Figure 4. Body Diode Forward Voltage  
Variation with Source Current  
and Temperature  
Figure 3. On Resistance Variation vs  
Drain Current and Gate Voltage  
100000  
10000  
1000  
100  
12  
10  
8
Ciss  
130V  
325V  
520V  
Coss  
Crss  
6
10  
4
1
2
※
Notes  
1. V

GS

= 0 V  
2. f = 1 MHz  
※
Notes  
1. I

D

= 14.3 A  
0.1  
0
100  
200  
300  
400  
500  
600  
0
10  
20  
30  
40  
50  
60  
70  
V

DS

Drain-Source Voltage [V]  
Q

G

[nC]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
– 3 –  

WTM30N65AMP  
650V N-Channel Super Junction MOSFET  
Typical Characteristics  
2.5  
2
1.2  
1.1  
1
1.5  
1
0.9  
0.8  
0.5  
※
Notes  
1. V

GS

= 0 V  
2. I

D

= 1 mA  
※
Notes  
1. V

GS

= 10 V  
2. I

D

= 10.2 A  
0
-100  
-50  
0
50  
100  
150  
200  
-100  
-50  
0
50  
100  
150  
200  
T

J

[
℃
]  
T

J

[
℃
]  
Figure 8. On-Resistance Variation  
vs. Temperature  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
28  
24  
20  
16  
12  
8
1000  
100  
10  
10us  
100us  
1ms  
DC  
1
0.1  
※
Notes  
0.01  
0.001  
1. T

C

= 25
℃  
2. T

J(MAX)

= 150
℃  
3. Single Pulse  
4
0
25  
50  
75  
100  
125  
150  
0.1  
1
10  
100  
1000  
T

C

[
℃
]  
V

DS

[V]  
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current  
vs. Case Temperature  
1
0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
single pulse  
0.01  
1E-05  
0.0001  
0.001  
0.01  
0.1  
t

P

[S]  
Figure 11. Transient Thermal Response Curve  
– 4 –  

WTM30N65AMP  
650V N-Channel Super Junction MOSFET  
Fig 12.
 
Gate Charge Test Circuit
 
& Waveform  
V

GS  

Same Type  
as DUT  
50KΩ  
Q

g  

12V  
200nF  
10V  
300nF  
V

DS  

V

GS  

Q

gs  

Q

gd  

DUT  
3mA  
Charge  
Fig 13.
 
Resistive Switching Test Circuit
 
& Waveforms  
R

L  

V

DS  

90%  
V

DS  

V

DD  

( 0.5 rated V

DS  

)
R

G  

10%  
V

in  

DUT  
10V  
t

d(on)  

t

r  

t

d(off)  

t

f  

t

on  

t

off  

Fig 14.
 
Unclamped Inductive Switching Test Circuit
 
& Waveforms  
BV

DSS  

——————–  
BV

DSS

— V

DD  

L
1
2
2
—-  
E

AS  

=
L

L

I

AS  

V

DS  

V

DD  

BV

DSS  

I

AS  

I

D  

R

G  

I

D

(t)  
V

DD  

V

DS

(t)  
DUT  
10V  
t

p  

Time  
– 5 –  

WTM30N65AMP  
650V N-Channel Super Junction MOSFET  
Fig 15.
 
Peak Diode Recovery dv/dt Test Circuit
 
& Waveforms  
DUT  
+
V

DS  

_
R

1  

I

S  

L
Driver  
R

2  

Same Type  
as DUT  
V

DD  

V

GS  

• dv/dt controlled by
 
R

G  

• I

S

controlled by pulse period  
Gate Pulse Width  
————————–  
V

GS  

D =  
Gate Pulse Period  
10V  
( Driver )  
I

FM

, Body Diode Forward Current  
di

F

/dt  
t

rr  

I

S  

t

F  

t

S  

( DUT )  
10% I

RM  

I

RM  

Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V

f  

V

DS  

( DUT )  
V

DD  

Body Diode  
Forward Voltage Drop  
–
6
–  

WTM30N65AMP  
650V N-Channel Super Junction MOSFET  
TO-247  
–
7
–