Wuxi-NCE-Power-Semiconductor-NCE609
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Pb Free Product
NCE609
N and P-Channel Enhancement Mode Power MOSFET
Description
The NCE609 uses advanced trench technology to provide
excellent R
DS(ON)
and low gate charge . The complementary
MOSFETs may be used to form a level shifted high side
switch, and for a host of other applications.
General Features
●
N-Channel
Schematic diagram
V
DS
=40
V
,
I
D
=21A
R
DS(ON)
< 19m
Ω
@ V
GS
=10V
DS(ON)
< 29m
Ω
@ V
GS
=4.5V
R
●
P-Channel
V
DS
=-40
V
,
I
D
= -14A
R
DS(ON)
<35m
Ω
@ V
GS
=-10V
DS(ON)
< 45m
Ω
@ V
GS
=-4.5V
R
Marking and pin assignment
100% UIS TESTED!
●
High power and current handing capability
●
Lead free product is acquired
●
Surface mount package
100%
∆
Vds TESTED!
Package Marking and Ordering Information
Device Marking
Device
Device Package
Reel Size
Tape width
Quantity
NCE609
NCE609
TO-252-4L
–
–
–
Absolute Maximum Ratings (T
A
=25
℃
unless otherwise noted)
Parameter
Symbol
V
DS
N-Channel P-Channel
Unit
V
Drain-Source Voltage
Gate-Source Voltage
40
±20
-40
±20
V
GS
V
T
A
=25
℃
T
A
=70
℃
21
-14
Continuous Drain Current
I
D
A
17.5
40
-11.5
-40
Pulsed Drain Current
(Note 1)
Maximum Power Dissipation
I
DM
P
D
A
T
A
=25
℃
40
40
W
℃
Operating Junction and Storage Temperature Range
T
J
,T
STG
-55
T
o
1
50
-55
T
o
1
50
Thermal Characteristic
Thermal Resistance,Junction-to-Case
(Note2)
Thermal Resistance,Junction-to-Case
(Note2)
R
θ
JC
R
θ
JC
N-Ch
P-Ch
3.1
3.1
℃
/W
℃
/W
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NCE609
N-CH Electrical Characteristics (T
A
=25
℃
unless otherwise noted)
Parameter
Symbol
Condition
Min Typ
Max
Unit
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
On Characteristics
(Note 3)
Gate Threshold Voltage
BV
DSS
I
DSS
V
GS
=0V I
D
=250
μ
A
V
DS
=40V,V
GS
=0V
V
GS
=±20V,V
DS
=0V
40
–
–
–
–
–
1
V
μ
A
nA
I
GSS
–
±100
V
GS(th)
R
DS(ON)
g
FS
V
DS
=V
GS
,I
D
=250
μ
A
V
GS
=10V, I
D
=10A
V
GS
=4.5V, I
D
=5A
V
DS
=5V,I
D
=10A
1
–
1.5
14
19
15
2.0
19
29
–
V
m
Ω
m
Ω
S
Drain-Source On-State Resistance
–
Forward Transconductance
Dynamic Characteristics
(Note4)
Input Capacitance
C
lss
C
oss
C
rss
–
–
–
1500
215
–
–
–
PF
PF
PF
V
DS
=20V,V
GS
=0V,
Output Capacitance
F=1.0MHz
Reverse Transfer Capacitance
Switching Characteristics
(Note 4)
Turn-on Delay Time
135
t
d(on)
t
r
t
d(off)
t
f
–
–
–
–
–
–
–
4
11.5
18
–
–
–
–
–
–
–
nS
nS
nS
nS
nC
nC
nC
Turn-on Rise Time
V
DD
=20V, R
L
=2
Ω
V
GS
=10V,R
GEN
=3
Ω
Turn-Off Delay Time
Turn-Off Fall Time
5.6
24
Total Gate Charge
Q
g
Q
gs
Q
gd
V
DS
=20V,I
D
=10A,
Gate-Source Charge
4
V
GS
=10V
Gate-Drain Charge
3.5
Drain-Source Diode Characteristics
Diode Forward Voltage
(Note 3)
V
SD
V
GS
=0V,I
S
=10A
–
0.8
1.2
V
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NCE609
P-CH Electrical Characteristics (T
A
=25
℃
unless otherwise noted)
Parameter
Symbol
Condition
Min Typ
Max
Unit
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
On Characteristics
(Note 3)
Gate Threshold Voltage
BV
DSS
I
DSS
V
GS
=0V I
D
=-250
μ
A
V
DS
=-40V,V
GS
=0V
V
GS
=±20V,V
DS
=0V
-40
–
–
–
–
V
–
–
-1
μ
A
nA
I
GSS
±100
V
GS(th)
R
DS(ON)
g
FS
V
DS
=V
GS
,I
D
=-250
μ
A
V
GS
=-10V, I
D
=-7A
V
GS
=-4.5V, I
D
=-4A
V
DS
=-5V,I
D
=-7A
-1.0
-1.5
29
-2.0
35
45
–
V
m
Ω
m
Ω
S
–
–
–
Drain-Source On-State Resistance
34
Forward Transconductance
Dynamic Characteristics
(Note4)
Input Capacitance
15
C
lss
C
oss
C
rss
–
–
–
1225
190
–
–
–
PF
PF
PF
V
DS
=-20V,V
GS
=0V,
Output Capacitance
F=1.0MHz
Reverse Transfer Capacitance
Switching Characteristics
(Note 4)
Turn-on Delay Time
120
t
d(on)
t
r
t
d(off)
t
f
–
–
–
–
–
–
–
10
15
30
18
21
3.5
3.0
–
–
–
–
–
–
–
nS
nS
nS
nS
nC
nC
nC
Turn-on Rise Time
V
DD
=-20V, R
L
=2.3
Ω
GS
=-10V,R
GEN
=6
Ω
V
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Q
g
Q
gs
Q
gd
V
DS
=-20V,I
D
=-7A
GS
=-10V
Gate-Source Charge
V
Gate-Drain Charge
Drain-Source Diode Characteristics
Diode Forward Voltage
(Note 3)
V
SD
V
GS
=0V,I
S
=-14A
–
–
-1.2
V
Notes:
1.
Repetitive Rating: Pulse width limited by maximum junction temperature.
2.
Surface Mounted on FR4 Board, t
≤
10 sec.
3.
Pulse Test: Pulse Width
≤
300
μ
s, Duty Cycle
≤
2%.
4.
Guaranteed by design, not subject to production
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NCE609
N- Channel Typical Electrical and Thermal Characteristics (Curves)
Vdd
Rl
t
on
t
r
t
off
t
f
t
d(on)
V
OUT
V
IN
t
d(off)
Vin
90%
90%
D
Vout
Vgs
INVERTED
Rgen
10%
90%
G
10%
50%
S
50%
10%
PULSE WIDTH
Figure 1:Switching Test Circuit
Figure 2:Switching Waveforms
Vds Drain-Source Voltage (V)
Vgs Gate-Source Voltage (V)
Figure 3 Output Characteristics
Figure 4 Transfer Characteristics
I
D
– Drain Current (A)
T
J
-Junction
T
e
mperature(
℃
)
Figure 5 Drain-Source On-Resistance
Figure 6 Drain-Source On-Resistance
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NCE609
Vgs Gate-Source Voltage (V)
T
J
-Junction
T
e
mperature(
℃
)
Figure 8 Power Dissipation
Figure7 Rdson vs Vgs
Qg Gate Charge (nC)
Vds Drain-Source Voltage (V)
Figure 9 Gate Charge
Figure 10 Source- Drain Diode Forward
Vds Drain-Source Voltage (V)
Vds Drain-Source Voltage (V)
Figure 11 Capacitance vs Vds
Figure 12 Safe Operation Area
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NCE609
Square Wave Pluse Duration(sec)
Figure 13 Normalized Maximum Transient Thermal Impedance
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NCE609
P- Channel Typical Electrical and Thermal Characteristics (Curves)
-Vds Drain-Source Voltage (V)
T
J
-Junction
T
e
mperature(
℃
)
Figure 1 Output Characteristics
Figure 4 Rdson-Junction Temperature
Qg Gate Charge (nC)
-Vgs Gate-Source Voltage (V)
Figure 5 Gate Charge
Figure 2 Transfer Characteristics
-Vsd Source-Drain Voltage (V)
–
I
D
– Drain Current (A)
Figure 6 Source- Drain Diode Forward
Figure 3 Rdson-
Drain Current
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NCE609
-Vds Drain-Source Voltage (V)
T
J
-Junction
T
e
mperature(
℃
)
Figure 9 Power Dissipation
Figure 7 Capacitance vs Vds
-Vds Drain-Source Voltage (V)
T
J
-Junction
T
e
mperature(
℃
)
Figure 8 Safe Operation Area
Figure 10 V
GS(th)
vs Junction Temperature
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
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TO-252-4L Package Information
NCE609
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NCE609
Attention
■
Any and all NCE power products described or contained herein do not have specifications that can handle applications that
require extremely high levels of reliability, such as life-support systems, aircraft’s control systems, or other applications
whose failure can be
reasonably expected to result in serious physical and/or material damage. Consult
with your NCE
power representative nearest you before using any NCE power products described or contained herein in
such applications.
■
NCE power
assumes no responsibility for equipment failures that result from using products at values
that exceed,
even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters)
listed in products specifications of any and all NCE power products described or contained herein.
■
Specifications of any and all NCE power products described or contained herein stipulate the performance, characteristics,
and functions of the described products in the independent state, and are not guarantees of the performance, characteristics,
and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states
that cannot
be evaluated in an independent device, the customer should always evaluate and test
devices mounted
in the
customer’s products or equipment.
■
NCE power Semiconductor CO.,LTD. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail
with some probability. It is possible that these probabilistic failures could
give rise to
accidents or events that could
endanger human lives, that could give rise to smoke or fire, or that could
cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or
events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe
design, redundant design, and structural design.
■
In the event that any or all NCE power products(including technical data, services) described or contained herein are
controlled under any of applicable local export control laws and regulations, such products must not be exported without
obtaining the export license from the authorities concerned in accordance with the above law.
■
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including
photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission
of NCE power Semiconductor CO.,LTD.
■
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume
production. NCE power believes information herein is accurate and reliable, but no guarantees are made or implied
regarding its use or any infringements of intellectual property rights or other rights of third parties.
■
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the “Delivery Specification” for the NCE power
product that you intend to use.
■
This catalog provides information as of Sep.2010. Specifications and information herein are subject to change without notice.
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