WUXI-UNIGROUP-MICRO-TPW60R040MFD

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WUXI-UNIGROUP-MICRO-TPW60R040MFD
TPW60R040MFD  
Wuxi Unigroup Microelectronics Co.,Ltd  
600V Super-junction Power MOSFET  
DESCRIPTION  
600V Super-junction Power MOSFET  
Super-junction power MOSFET is a revolutionary technology for high voltage power MOSFE
T
s
,  
designed according to the SJ principle and pioneered. The Multi-EPI SJ MOSFET provide an  
extremely fast and robust body diode. Also provide an extremely low switching, communication  
and conduction losses device with highest robustness make especially resonant switching  
applications more reliable, more efficient, lighter and cooler, also fits the industrial grade  
applications,like AC-DC SMPS requirements for PFC, AC/DC power conversion, designed by  
Wuxi Unigroup Microelectronics Company.  
FEATURES  
APPLICATIONS  
l
Ultra-fast body diode  
l
Very low FOM R

DS(on)

×
Q

g  

l
Easy to use/drive  
l
100% avalanche tested  
l
RoHS compliant  
l
Switch Mode Power Supply (SMPS)  
l
Uninterruptible Power Supply (UPS)  
l
Power Factor Correction (PFC)  
l
LLC Half-bridge  
l
Charger  
Device Marking and Package Information  
Device  
Package  
Marking  
TPW60R040MFD  
TO-247  
60R040MFD  
Key Performance Parameters  
Parameter  
Value  
600  
0.04  
72  
Unit  
V
V

DS

@ T

j,max  

R

DS(on),max  

Ω
I

D  

A
Q

g,typ  

I

DM  

t

rr  

169  
216  
225  
1.4  
nC  
A
ns  
μC  
A
Q

rr  

I

rrm  

12.5  
V1.0  
1

TPW60R040MFD  
Wuxi Unigroup Microelectronics Co.,Ltd  
Absolute Maximum Ratings
 
T

C

= 25ºC, unless otherwise noted  
Parameter  
Symbol  
Value  
600  
72  
Unit  
Drain-Source Voltage (V

GS

= 0V)  
V

DSS  

V
T

C

= 25ºC  
Continuous Drain Current  
I

D  

A
TC = 100ºC  
43.2  
216  
±
30  
Pulsed Drain Current  
(note1)  
I

DM  

V

GSS  

E

AS  

E

AR  

I

AR  

A
V
Gate-Source Voltage  
Single Pulse Avalanche Energy  
Repetitive Avalanche Energy  
Avalanche Current  
(note2)  
(note2)  
2185  
3.31  
13.7  
50  
mJ  
mJ  
A
MOSFET dv/dt ruggedness, V

DS

= 0…480V  
Power Dissipation  
dv/dt  
P

D  

V/ns  
W
500  
Continuous Body Diode Current  
Pulsed Diode Forward Current  
Reverse diode dv/dt  
I

S  

72  
216  
A
(note1)  
(note3)  
(note3)  
I

SM  

dv/dt  
di

f

/dt  
T

J

, T

stg  

50  
V/ns  
A/us  
ºC  
Maximum diode commutation speed  
900  
Operating Junction and Storage Temperature Range  
-55~+150  
Thermal Resistance  
Parameter  
Symbol  
Value  
Unit  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
R

thJC  

R

thJA  

0.25  
62  
ºC/W  
V1.0  
2

TPW60R040MFD  
Wuxi Unigroup Microelectronics Co.,Ltd  
Specifications
T

J

= 25ºC, unless otherwise noted  
Value  
Parameter  
Symbol  
Test Conditions  
Unit  
Min.  
Typ.  
Max.  
Static  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
V

(BR)DSS  

I

DSS  

V

GS

= 0V, I

D

= 250µA  
V

DS

= 600V, V

GS

= 0V, T

J

= 25ºC  
V

GS

=
±
30V  
600  
—  
—  
—  
—  
—  
—  
10  
V
μA  
nA  
V
I

GSS  

—  
±
100  
5
Gate-Source Threshold Voltage  
V

GS(th)  

V

DS

= V

GS

, I

D

= 250µA  
3
Drain-Source On-Resistance  
R

DS(on)  

R

G  

V

GS

= 10V, I

D

= 36A  
—  
—  
0.035  
0.3  
0.04  
—  
Ω
Ω
Gate resistance  
f = 1.0MHz open drain  
Dynamic  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
C

iss  

C

oss  

C

rss  

Q

g  

—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
8043  
283  
3.6  
169  
50  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
V

GS

= 0V,  
V

DS

= 100V,  
f = 1.0MHz  
pF  
nC  
V

DD

= 520V, I

D

= 50A,  
V

GS

= 10V  
Q

gs  

Q

gd  

t

d(on)  

t

r  

65  
91  
90  
V

DD

= 400V, I

D

= 50A,  
R

G

= 25Ω  
ns  
t

d(off)  

t

f  

583  
133  
Drain-Source Body Diode Characteristics  
Body Diode Voltage  
V

SD  

T

J

= 25ºC, I

SD

= 36A, V

GS

= 0V  
—  
1.0  
1.5  
V
Reverse Recovery Time  
t

rr  

—  
—  
—  
225  
1.4  
—  
—  
—  
ns  
μC  
A
V

R

= 400V, I

F

= 50A,  
di

F

/dt = 100A/μs  
Reverse Recovery Charge  
Peak Reverse Recovery Current  
Q

rr  

I

rrm  

12.5  
Notes  
1. Repetitive
 
Rating: Pulse width limited by maximum junction temperature  
2. I

AS

= 13.7A, V

DD

= 50V, R

G

= 25Ω, Starting T

J

= 25
°
C  
3. Identical
 
low side and high side switch with identical R

G  

V1.0  
3

TPW60R040MFD  
Wuxi Unigroup Microelectronics Co.,Ltd  
Typical Characteristics
 
T

J

= 25
º
C, unless otherwise noted  
Figure 1. Output Characteristics  
Figure 2. Transfer Characteristics  
300  
250  
200  
150  
100  
50  
300  
250  
200  
150  
100  
50  
V

DS

= 20V  
20V  
10V  
8V  
7V  
6V  
T

J

= 25ºC  
5.5V  
5V  
T

J

= 150ºC  
0
0
0
5
10  
15  
20  
0
2
4
6
8
10  
V

DS

, Drain-to-Source Voltage (V)  
V

GS

, Gate-to-Source Voltage (V)  
Figure 3. On-Resistance vs. Drain Current  
Figure 4. Capacitance  
0.06  
0.05  
0.04  
0.03  
0.02  
10

5  

V

GS

= 0  
f = 1MHz  
V

GS

= 10V  
T

J

= 25ºC  
10

4  

10

3  

10

2  

10

1  

10

0  

C

iss  

C

oss  

C

rss  

500  
0
10  
20  
30  
40  
50  
60  
0
100  
200  
300  
400  
600  
I

D

, Drain Current (A)  
V

DS

, Drain-to-Source Voltage (V)  
Figure 5. Gate Charge  
Figure 6. Body Diode Forward Voltage  
12  
10  
8
10

2  

10

1  

10

0  

T

J

= 125ºC  
V

DD

= 120V  
V

DD

= 480V  
6
T

J

= 25ºC  
4
2
10

-1  

0
0
50  
100  
150  
200  
0.0  
0.5  
1.0  
1.5  
Q

g

, Total Gate Charge (nC)  
V

SD

, Source-to-Drain Voltage (V)  
V1.0  
4

TPW60R040MFD  
Wuxi Unigroup Microelectronics Co.,Ltd  
Typical Characteristics
 
T

J

= 25
º
C, unless otherwise noted  
Figure 7. On-Resistance vs.  
Junction Temperature  
Figure 8. Breakdown voltage vs.  
Junction Temperature  
1.3  
1.2  
1.1  
1
3
2.5  
2
V

GS

= 10V  
I

D

= 36A  
I

D

= 250µA  
1.5  
1
0.9  
0.5  
0.8  
0
-30  
0
30  
60  
90  
120  
150  
-50  
0
50  
100  
150  
T

J

, Junction Temperature (
º
C)  
T

J

, Junction Temperature (
º
C)  
Figure 10. Safe operation area for  
TO-247  
Figure9 . Transient Thermal Impedance for  
TO-247  
10

3  

10

2  

10

1  

10

0  

10

-1  

10

0  

10

-1  

D = 0.5  
D = 0.2  
D = 0.1  
t

p

= 1us  
t

p

= 10us  
t

p

= 100us  
t

p

= 1ms  
t

p

= 10ms  
DC  
10

-2  

D = 0.05  
D = 0.02  
D = 0.01  
Single Pulse  
10

-3  

10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

10

0  

10

1  

10

2  

10

3  

V

DS

, Drain-Source Voltage(V)  
T

p

, Pulse Width (s)  
V1.0  
5

TPW60R040MFD  
Wuxi Unigroup Microelectronics Co.,Ltd  
Figure A
:
Gate Charge Test Circuit and Waveform  
Figure B
:
Resistive Switching Test Circuit and Waveform  
Figure C
:
Unclamped Inductive Switching Test Circuit and Waveform  
V1.0  
6

TPW60R040MFD  
Wuxi Unigroup Microelectronics Co.,Ltd  
TO-247  
Unit:mm  
Unit:mm  
Symbol  
Min.  
Nom  
Max.  
Symbol  
Min.  
Nom.  
Max.  
A
A1  
A2  
b
4.80  
2.21  
1.85  
1.11  
1.91  
2.91  
0.51  
20.70  
16.25  
5.00  
2.41  
2.00  
1.21  
2.01  
3.01  
0.61  
21.00  
16.55  
5.20  
2.61  
2.15  
1.36  
2.21  
3.21  
0.75  
21.30  
16.85  
E
E1  
E2  
E3  
e
15.50  
13.00  
4.80  
15.80  
13.30  
5.00  
16.10  
13.60  
5.20  
2.30  
2.50  
2.70  
b2  
b4  
c
5.44BSC  
19.92  
–
L
19.62  
20.22  
4.30  
3.80  
7.30  
L1  
ФP  
ФP1  
S
–
3.40  
–
D
3.60  
D1  
–
6.15BSC  
V1.0  
7

TPW60R040MFD  
Wuxi Unigroup Microelectronics Co.,Ltd  
Disclaimer  
All product specifications and data are subject to change without notice.  
For documents and material available from this datasheet, Wuxi Unigroup does not warrant or assume  
any legal liability or responsibility for the accuracy, completeness of any product or technology  
disclosed hereunder.  
No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted  
by this document or by any conduct of Wuxi Unigroup.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining  
applications. Customers using or selling Wuxi Unigroup products not expressly indicated for use in  
such applications do so entirely at their own risk and agree to fully indemnify Wuxi Unigroup for any  
damages arising or resulting from such use or sale.  
Wuxi Unigroup disclaims any and all liability arising out of the use or application of any product  
described herein or of any information provided herein to the maximum extent permitted by law. The  
product specifications do not expand or otherwise modify Wuxi Unigroup’s terms and conditions of  
purchase, including but not limited to the warranty expressed therein, which apply to these products.  
Wuxi Unigroup Microelectronics CO., LTD. strives to supply high-quality high-reliability products.  
However, any and all semiconductor products fail with some probability. It is possible that these  
probabilistic failures could give rise to accidents or events that could endanger human lives that could  
give rise to smoke or fire, or that could cause damage to other property. When designing equipment,  
adopt safety measures so that these kinds of accidents or events cannot occur. Such measures  
include but are not limited to protective circuits and error prevention circuits for safe design, redundant  
design, and structural design.  
In the event that any or all Wuxi Unigroup products (including technical data, services) described or  
contained herein are controlled under any of applicable local export control laws and regulations, such  
products must not be exported without obtaining the export license from the authorities concerned in  
accordance with the above law.  
Information (including circuit diagrams and circuit parameters) herein is for example only. It is not  
guaranteed for volume production. Wuxi Unigroup believes information herein is accurate and reliable,  
but no guarantees are made or implied regarding its use or any infringements of intellectual property  
rights or other rights of third parties.  
V1.0  
8