Yangzhou-Yangjie-Elec-Tech-MT200CB08T2

Part #Yangzhou-Yangjie-Elec-Tech-MT200CB08T2
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Yangzhou-Yangjie-Elec-Tech-MT200CB08T2
RoHS  
MT200CB-T2  
COMPLIANT  
Thyristor/Diode Modules  
V
RRM
/ V
DRM  
I
FAV
/ I
TAV  
800 to 1800V  
200A  
Applications  
Power Converters  
Lighting Control  
DC Motor Control and Drives  
Heat and temperature control  
Circuit  
Features  
International standard package  
High Surge Capability  
Glass passivated chip  
Simple Mounting  
Heat transfer through aluminum oxide DBC  
ceramic isolated metal baseplate  
UL recognized applied for file no. E360040  
Module Type  
TYPE  
V
RRM/
V
DRM  
V
RSM  
MT200CB08T2  
MT200CB12T2  
MT200CB16T2  
MT200CB18T2  
800V  
1200V  
1600V  
1800V  
900V  
1300V  
1700V  
1900V  
◆
Diode  
Maximum Ratings  
Symbol  
Item  
Conditions  
Values  
Units  
A
I
D  
I
FSM  
i

2

t  
Output Current(D.C.)  
Tc=85
℃  
200  
Surge forward current  
t=10mS Tvj =45
℃  
6800  
A
A

2

s  
Circuit Fusing Consideration  
Isolation Breakdown Voltage(R.M.S)  
Operating Junction Temperature  
Storage Temperature  
231200  
3000  
Visol  
Tvj  
a.c.50HZ;r.m.s.;1min  
V
-40 to +125  
-40 to +125  
3±15%  
5±15%  
165  
℃
Tstg  
Mt  
℃
Mounting Torque  
To terminals(M6)  
To heat sink(M6)  
Nm  
Nm  
g
Ms  
Weight  
Module
(
Approximately
)  
Thermal Characteristics  
Symbol  
R
th(j-c)  
Item  
Conditions  
Junction to Case  
Values  
0.08  
Units  
℃
/W  
Thermal Impedance, max.  
Rth(c-s) Thermal
 
Impedance, max.  
Case to Heat sink  
0.05  
℃
/W  
Electrical Characteristics  
Values  
Min. Typ.  
Symbol  
V
FM  
Item  
Conditions  
Units  
Max.  
1.70  
Forward Voltage Drop, max.  
V
T=25
℃
I
F
=620A  
T
vj
=25
℃
V
RD
=V
RRM  
T
vj
=125
℃
V
RD
=V
RRM  
Repetitive Peak Reverse Current,  
max.  
≤
0.5  
≤
9  
mA  
mA  
I
RRM  
S-M314  
www.
21yangjie
.com  
Rev.1.0,02-Dec-19  
1

RoHS  
MT200CB-T2  
COMPLIANT  
◆
Thyristor  
Maximum Ratings  
Symbol  
Item  
Conditions  
Values  
Units  
I

TAV  

Average On-State Current  
Sine 180

o

;Tc=85
℃  
200  
A
T

VJ

=45
℃
t=10ms, sine  
T

VJ

=125
℃
t=10ms, sine  
5500  
5000  
I

TSM  

Surge On-State Current  
A
T

VJ

=45
℃
t=10ms, sine  
T

VJ

=125
℃
t=10ms, sine  
151000  
125000  
i

2

t  
Circuit Fusing Consideration  
A2s  
Visol  
Tvj  
Isolation Breakdown Voltage(R.M.S)
 
a.c.50HZ;r.m.s.;1min  
Operating Junction Temperature  
3000  
V
-40 to +125  
-40 to +125  
3
±
15%  
℃
Tstg  
Mt  
Storage Temperature  
℃
Mounting Torque  
To terminals(M6)  
To heat sink(M6)  
Nm  
Nm  
Ms  
5
±
15%  
Critical Rate of Rise of On-State  
Current  
T

VJ

= T

VJM

, 2/3V

DRM

,I

G

=500mA  
Tr<0.5us,tp>6us  
di/dt  
200  
A/us  
Critical Rate of Rise of Off-State  
Voltage, min.  
dv/dt  
a
T

J

=T

VJM

,2/3V

DRM

linear voltage rise  
1000  
50  
V/us  
m/s

2  

Maximum allowable acceleration  
Thermal Characteristics  
Symbol  
R
th(j-c)  
Item  
Conditions  
Junction to Case  
Values  
0.16  
Units  
℃
/W  
Thermal Impedance, max.  
Rth(c-s)  
Thermal Impedance, max.  
Case to Heat sink  
0.10  
℃
/W  
Electrical Characteristics  
Values  
Min. Typ.
 
Max.  
Symbol  
Item  
Conditions  
Units  
V

TM  

Peak On-State Voltage, max.  
T=25
℃
I

T

=620A  
1.70  
V
Repetitive Peak Reverse Current,  
max. / Repetitive Peak Off-State  
Current, max.  
T

VJ

=T

VJM

,V

R

=V

RRM

,V

D

=  
V

DRM  

I

RRM

/I

DRM  

40  
mA  
For power-loss  
calculations only  
(T

VJ

=125
℃
)  
V

TO  

On state threshold voltage  
0.85  
1.5  
V
Value of on-state  
slope resistance. max  
r

T  

T

VJ

=T

VJM  

m
Ω  
V

GT  

I

GT  

V

GD  

I

GD  

I

L  

Gate Trigger Voltage, max.  
Gate Trigger Current, max.  
Non-triggering gate voltage, max.  
Non-triggering gate current, max.  
Latching current, max.  
T

VJ

=25
℃
, V

D

=6V  
3
V
T

VJ

=25
℃
, V

D

=6V  
200  
0.25  
10  
mA  
V
T

VJ

=125
℃
,V

D

=2/3V

DRM  

T

VJ

=125
℃
, V

D

=2/3V

DRM  

T

VJ

=25
℃
, R

G

= 33
Ω  
T

VJ

=25
℃
, V

D

=6V  
mA  
mA  
mA  
300  
150  
1000  
400  
I

H  

Holding current, max.  
TVJ=25
℃
,  
IG=1A, di

G

/dt=1A/us  
tgd  
tq  
Gate controlled delay time  
1
us  
us  
Circuit commutated turn-off time  
T

VJ

=T

VJM  

100  
S-M314  
www.
21yangjie
.com  
Rev.1.0,02-Dec-19  
2

RoHS  
MT200CB-T2  
COMPLIANT  
Performance Curves  
300  
W
300  
A
DC  
240  
sin.180  
rec.120  
DC  
200  
rec.60  
180  
sin.180  
rec.120  
rec.30  
120  
60  
rec.60  
rec.30  
100  
P

TAV  

0
I

TAVM  

0
0
I
TAV  
50  
100  
150  
A
200  
0
Tc  
50  
100  
℃
130  
Fig1. Power dissipation  
Fig2.Forward Current Derating Curve  
6000  
A
0.30  
50HZ  
℃
/ W  
Z
th(j-
S
)  
0.1  
3000  
Z
th(j-
C
)  
0
0
10  
100  
ms 1000  
0.001  
t
0.01  
0.1  
1
10  
S 100  
Fig3. Transient thermal impedance  
Fig4. Max Non-Repetitive Forward Surge  
Current  
600  
A
Typ
.  
400  
max
.  
200  
25
℃  
– – –
125
℃  
I

T  

0
0
V

TM  

0.5  
1.0  
1.5  
V
2.0  
Fig5. Forward Characteristics  
S-M314  
Rev.1.0,02-Dec-19  
www.
21yangjie
.com  
3

RoHS  
MT200CB-T2  
COMPLIANT  
100  
V
1/2
·
MT200CB18T2  
20V;20
Ω  
10  
1
V

GT  

∧
PG(tp)  
-40
℃  
25
℃  
T

vj  

125
℃  
V

GD125  

℃
I

GT  

V

G  

I

GD125  

℃
0.1  
0.001 I

G  

0.01  
0.1  
1
10  
A 100  
Fig6. Gate trigger Characteristics  
Package Outline Information  
CASE: T2  
Dimensions in mm  
S-M314  
www.
21yangjie
.com  
Rev.1.0,02-Dec-19  
4