ZHHXDZ-AO4884-HX

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ZHHXDZ-AO4884-HX
珠海海芯电子有限公司  
AO4884-HX N-Channel 40-V (D-S) MOSFET  
PRODUCT SUMMARY  
V
DS
(V)  
R
DS(on)
(
Ω
)  
Qg (Typ.)  
I
D
(A)  
0.016 at V
GS
= 10
 
V  
0.019 at V
GS
= 4.5 V  
8
8
40  
5.9nC  
FEATURES  
®
⚫
TrenchFET Power
 
MOSFET  
⚫
⚫
100 % R
 
T
e
sted  
g
UIS
T
e
sted  
APPLICATIONS  
⚫
CCFL Inverter  
ABSOLUTE MAXI
Param
25 °C, unless otherwise noted  
Symbol  
Limit  
Unit  
V
Drain
–
Source
40  
DS  
V
V
GS  
Gate
–
Source Volt
± 16  
8
8
Continuous Drain Current (T
 
= 150 °C)  
J
b,  
8
T
A
6.5  
20  
Pulsed Drain Current (10 µs Pulse Width)  
T
= 25 °
2.7  
C
Source
–
Drain Current Diode Current  
A
T
= 25 °C  
A
Pulsed Source
–
Drain Current  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
L = 0.1 mH  
T
T
= 25 °C  
C
= 70 °C  
C
P
D
Maximum Power Dissipation  
T
= 25 °C  
= 70 °C  
A

T
A
Operating Junction and Storage
T
e
mperature Range  
TJ,
T
s
tg  
–
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typ.  
45  
M
62.5  
38  
Maximum Junction
–
to
–
Ambient

b, d  

t
≤
10 s  
R
thJA  
Maximum Junction
–
to
–
Foot (Drain)
 
Steady
–
State  
R
thJF  
29  
Notes  
a.
Based on TC = 25 °C.  
b.
Surface Mounted on 1″ x 1″ FR4 board.  
c . t = 10 s.  
c.
Maximum under steady state conditions is 120 °C/W.  
Version 1.0  
–
1
–  
Date
:
Jan. 2022  

珠海海芯电子有限公司  
SPECIFICATIONS
T =
 
25 °C, unless otherwise noted  
J
Min. Typ. Max. Unit  
Parameter  
Symbol  
Test Conditions  
Static  
V

DS  

V

GS

= 0 V,
I

D

= 250 µA  
I

D

= 250 µA  
40  
V
Drain
–
Source Breakdown Voltage  
ΔV

DS

/T

J  

V

DS

T
e
mperature Coefficient  
40  
mV/°C  
ΔV

GS(th)  

V

GS(th)  

I

GSS  

/
V

GS(th)

T
e
mperature C
cient  
I

D

= 250
 
µA  
–
4.8  
V

DS

= V

GS

, I

D

= 250 µA  
V

DS

= 0 V, V

GS

= ± 16 V  
V

DS

= 40 V, V

GS

= 0 V  
V

DS

= 40 V, V

GS

= 0 V, T

J

=  
V

DS

= 5 V, V

GS

= 10 V  
V

GS

= 10 V, I

D

= 5 A  
V

GS

= 4.5
V
,
I

D

= 4 A  
V

DS

= 15 V, I

D

= 5 A  
0.8  
2.0  
100  
1
V
Gate Thresho
nA  
µA  
Gate
–
I

DSS  

Zero G
10  
On
–
Sta

n)  

20  
A
0.013 0.016  
0.015 0.019  
23  
Ω
Drain
–
Source On
–

Forward Transcon

S
a
Dynamic  

N
–
Channel  
2390  
270  
Input Capacitance  
Output Capacitance  
pF  

GS

= 0 V,
I

D

= 1 MHz  
165  
Reverse Transfer Capacitance  

0 V,
I

D

= 5 A  
56  
26  
5.5  
9.7  
2.6  
15  
20  
56  
85  
40  

T
o
tal Gate Charge  
Q

g

Q

gd  

R

g  

Gate
–
Source Charge  
Gate
–
Drain Charge  
Gate Resistance  
Turn
–
On Delay Time  
Rise Time  

D

= 5 A  
nC  
4.0  
23  
t

d(on)  

t

r  

t

d(off)  

t

f  

t

d(on)  

t

r  

t

d(off)  

t

f  

V

D

I

D

5 A, V

G

30  
85  
Turn
–
Off Delay Time  
Fall Time  
15  
135  
80  
Turn
–
On Delay Time  
Rise Time  
ns  
N
–
Chan
V

DD

= 20
V
,
R

L

I

D

5 A, V

GEN

= 4.5 V,

Turn
–
Off Delay Time  
Fall Time  
Drain
–
Source Body Diode Characteristics  
I

S  

I

SM  

V

SD  

t

rr  

T

C

= 25 °C  
I

S

= 1.5 A  
Continuous Source
–
Drain Diode Current  
Pulse Diode Forward Current

a  

Body Diode Voltage  
26  
36  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
N
–
Channel  
I

F

= 2 A, dI/dt = 100 A/µs, T

J

=  
25 °C  
Q

rr  

t

a  

t

b  

Notes  
a.
Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.  
b.
Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress  
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections  
of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
Version 1.0  
–
2
–  
Date
:
Jan. 2022  

珠海海芯电子有限公司  

V
D

V
GS,

Gate
–
to
–
Source Voltage (V)  
Fig 2. Typical Transfer Characteristics  
Fig 1. Typica
(°C)  
ature  
I
D
–
Drain Current (A)  
Fig 3. On
–
Resistance vs. Drain Current  
and Gate Voltage  
unction Temperature  

V
DS,

Drain
–
to
–
Source Voltage (V)  
V
SD,
Source
–
to
–
Drain Voltage (V)  
Fig6.Capacitance  
Fig 5. Typical Source
–
Drain Diode  
Forward Voltage  
Version 1.0  
–
3
–  
Date
:
Jan. 2022  

珠海海芯电子有限公司  

V
DS,

Drain
–
to
–
Source Voltage (V)  
Fig 7. Gat
Fig 8.Maximum Safe Operating Area  

T
J

–
T
e
mperature (°C)  
Fig 9. Threshold Voltage  

Voltage (V)  
. Gate
–
to
–
Source Voltage  
T
C
,Case
T
e
mperature (
°
C)  
T
C
,Case
T
e
mperature(°C)  
Fig 11. Current Derating*  
Fig 12. Power Derating, Junction
–
to
–
Fo
Version 1.0  
–
4
–  
Date
:
Jan. 2022  

珠海海芯电子有限公司  
Time (s)  
T

A

Fig 13. Single Pulse Power, Junction
–
to
–
Ambient  
Fig 12. Power
Square Wave Pulse Duratio
Fig 14. Normalized Thermal Transient Impedan
Square Wave Pulse Duration (s)  
Fig 14. Normalized Thermal Transient Impedance, Junction
–
to
–
Case  
* The power dissipation PD is based on TJ(max) = 150 °C, using junction
–
to
–
case thermal resistance, and is more useful in settling the  
upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls  
below the package limit.  
Version 1.0  
–
5
–  
Date
:
Jan. 2022  

珠海海芯电子有限公司  
SOP
–
8
ge Outline  
Di
shown in millimeters (inches)  
MILLIMETERS  
DIM  
INCHES  
Max  
Max  
Min  
1.35  
0.10  
.35  
Min  
1.75  
0.20  
0.51  
0.053  
0.004  
0.014  
0.069  
0.008  
0.020  
0.007  
5
0.25  
0.010  
5.00  
00  
0.189  
0.150  
0.196  
0.157  
e
0.050 BSC  
0.244  
H
h
0.5
0°  
0.228  
0.010  
20  
0.020  
L
q
0.037  
8°  
S
0.44  
0.026  
Version 1.0  
–
6
–  
Date
:
Jan. 2022  

珠海海芯电子有限公司  
RECOMMENDED MINIMUM PADS FOR SOP
–
8  
Version 1.0  
–
7
–  
Date
:
Jan. 2022  

珠海海芯电子有限公司  
SOP-8 packing information  
SOP-8 tape and reel  
Tape ori
–
8
–  
Version 1.0  
Date
:
Jan. 2022  

珠海海芯电子有限公司  
Disclaimer  
Al
ts due to improve reliability,
 
function or design or for other  
reaso
specifications and
 
data are subject to change without notice.  
ectronics Co.
 
, Ltd.
 
, branches, agents, employees, and  
ts or their
 
representatives
(
c
ollectively, the “
z
huhai  
no responsibility for any errors, inaccuracies or  
inc
n the table or any other any disclosure of any  
infor
roduct.(www.haixindianzi.com)  
Zh
arantee, representation or warranty on the  
product fo
f any goods or continuous production.
 
T
o
t
he  
maximum e
ble law on Zhuhai Haixin relinquished:
 
( 1 )  
any applicatio
out of or use of any products;
 
( 2 )
 
any  
and all liability,
to special,
 
consequential damages or  
incidental ; (
 
3 )
 
anties, including a particular purpose,  
non
–
infringement a
ntee.  
Statement on cer
are based on knowledge of the  
product is often used in
general product Haixin Zhuhai  
demand that the Zhuhai H
hether the product is suitable  
for a
 
particular application i
ustomer’ s
 
responsibility to  
verify specific
 
product feature
ed in the specification is  
appropriate for use in a partic
er data sheets and  
technical specifications can be pr
ing on the application  
and performance over time. All ope
ng typical  
parameters must be made by custom
idated for each  
customer application.
 
Product specific
modify Zhuhai  
Haixin purchasing terms and conditions,
to warranty  
herein.  
Unless expressly stated in writing,
 
Zhuha
intended  
for use in medical, life saving, or life sustainin
her  
application. Wherein
 
Haixin product failure coul
or  
death, use or sale of products used in Zhuhai Haix
g  
client did not express their own
 
risk. Contact
 
your a
people who are related to product design application
conditions in writing.  
The information provided in this document and the comp
without a license, express or implied, by estoppel or otherwise,
 
intellectual property rights granted to the Haixin act or document.
 
and trademarks referred to herein are trademarks of their respectiv
representatives will be all.  
Version 1.0  
–
9
–  
Date
:
Jan. 2022