ZHHXDZ-IRF7416TRPBF-HX
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珠海海芯电子有限公司
IRF7416TRPBF-HX P-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
(
Ω
)
Qg (Typ.)
I
D
(A)
-9.0
0.018 at V
GS
= – 10 V
0.024 at V
GS
= – 4.5 V
-30
13nC
-7.8
SOP
–
8
FEATURE
PPLICATIONS
®
⚫
TrenchFET P
Load Switch
⚫
100 % R
T
e
sted
g
ttery Switch
Absolute Maximum Ratings
Param
Max.
10
Units
Continuous Drain Current, V
GS
@
Continuous Drain Current, V
GS
@
–
1
Pulsed Drain Current
①
@ T
= 25°C
I
D
I
D
A
A
@ T
= 70°C
A
I
DM
Power Dissipation
W
P
D
@T
A
= 25°C
Linear Derating Factor
W
/
°C
Gate
–
to
–
Source Voltage
V
V
GS
E
AS
Single Pulse Avalanche Energy
②
J
dv/dt
Peak Diode Recovery dv/
dt
③
–
Operating Junction and
T
J
–
55 to
+ 1
Storage
T
e
mperature Range
T
STG
Thermal Resistance
Parameter
Max
Units
Junction
–
to
–
Ambient
⑤
°C/W
R
θJA
50
Version 1.0
–
1
–
Date
:
Jan. 2022
珠海海芯电子有限公司
Static Electrical Characteristics @ TJ = 25
°
C (unless otherwise specified)
Parameter
Drain
–
to
–
Source Breakdown Voltage
J
Bre
Voltage
T
emp.
Coefficient
Min. Typ. Max.
Units
Conditions
V
=0V,I =
–
250μA
V
( BR) DSS
GS
D
V
–
30
ΔV
(
B
R
)
DSS
/ΔT
Reference to 25°C,I
=
–
1mA
D
V/°C
–
0.024
V
=
–
10V,I =
–
5.6A
④
D
0.020
0.035
–
2.04
GS
R
DS
(
o
Ω
urceOn
–
Resistance
V
=
–
4.5V,I =
–
2.8A
④
GS
D
V
=V ,I
=
–
250μA
DS GS
D
Voltage
V
GS
gfs
–
1.0
V
ctance
V
=
–
10V,I =
–
2.8A
S
5.6
DS
D
μA
I
DSS
V
=
–
24V,V =0V
–
1.0
–
25
DS
GS
rrent
V
=
–
24V,V =0V,T
=125
°C
GS
DS
J
Gate
Gate
–
to
I
GSS
V
=
–
20V
–
100
100
GS
nA
V
=20V
GS
Dynamic Electrical
Cha
C (unless otherwise specified)
Parameter
T
o
tal Gate Charge
Gate
–
to
–
Source Charge
Gate
–
to
–
Drain
(
“
M
iller
“
)
C
harge
Turn
–
On Delay Time
Rise Time
. Units
Conditions
Q
g
I
D
=
–
5.6A
V
DS
=
–
24V
Q
gs
C
V
GS
=
–
10V
④
Q
gd
V
DD
=
–
15V
I
D
=
–
5.6A
t
d
(
o
n)
t
r
t
d
(
o
ff)
t
f
R
G
= 6.2Ω
Turn
–
Off Delay Time
Fall Time
R
D
= 2.7Ω
④
60
Input Capacitance
C
iss
C
oss
C
rss
= 0V
1700
890
410
Output Capacitance
Reverse Transfer Capacitance
25V
1 Diode Characteristics
Parameter
Min. Typ. Max.
Unit
I
S
I
SM
V
SD
t
rr
Continuous Source Current (Body Diode)
–
3.1
A
Pulsed Source Current
–
4.5
(
B
ody Diode)
①
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
–
1.0
85
V
T
J
=2
ns
nC
56
99
T
J
=2
di/dt = 1
Q
rr
150
Notes
①
Repetitive rating;
pulse width limited by
max. junction temperature.
②
starting T
J
= 25°C, L = 25mH,R
G
= 25Ω, I
AS
= .5.6A.
③
I
SD
≤ .5.6A, di/dt ≤ 100A/us, VDD ≤ V(BR)D
SS
, T
J
≤ 150°C
④
Pulse width ≤ 300us; duty cycle ≤ 2%.
⑤
S
urface mounted on FR.4 board,
t ≤
10sec.
Version 1.0
–
2
–
Date
:
Jan. 2022
珠海海芯电子有限公司
V
GS,
Gate
–
to
–
Source Voltage (V)
Fig 2. Typical Transfer Characteristics
Fig 1. Typi
V
DS,
Drain
–
to
–
Source Voltage (V)
T
J,
Junction
T
e
mperature ( C)
Fig
3.
Typical
Output
Fig 4. Normalized On
–
Resistance
Vs. Temperature
V
SD,
Source
–
to
–
Drain Voltage (V)
V
DS,
Drain
–
to
–
Source Voltage (V)
Fig 5. Typical Source
–
Drain Diode
Fig 6. Typical Capacitance Vs.
Forward Voltage
Drain
–
to
–
Source Voltage
Version 1.0
–
3
–
Date
:
Jan. 2022
珠海海芯电子有限公司
V
DS,
Drain
–
to
–
Source Voltage (V)
Q
G,
T
o
tal Gate Charge (nC)
Fig 7. Typical Gate Charge Vs.
Fig 8. Maximum Safe Operating
Gate
–
to
–
Source Voltage
(°C)
Starting T
J
, Junction
T
e
mperature
Fig 9. Maximum Avalanche Energy
Vs. Drain Current
t
1 ,
Rectangular Pulse Duration (sec)
Fig 10. Maximum Effective Transient Thermal Impedance, Junction
–
to
–
Ambient
Version 1.0
–
4
–
Date
:
Jan. 2022
珠海海芯电子有限公司
SO
–
8 Pa
tline
Dim
n in millimeters (inches)
MILLIMETERS
DIM
INCHES
Max
Max
Min
1.35
0.10
0.35
Min
A
1.75
0.20
0.51
0.053
0.004
0.014
0.069
0.008
0.020
0.007
5
9
0.25
0.010
5.00
4.00
0.189
0.150
0.196
0.157
0.050 BSC
0.244
H
h
0°
0.228
0.010
0.020
°
0.020
L
q
0.037
8°
S
0.44
0.026
RECOMMENDED MINIMUM PADS FOR SO
–
8
Version 1.0
–
5
–
Date
:
Jan. 2022
珠海海芯电子有限公司
SOP-8 packing information
SOP-8 tape and reel
Tape orientation
–
6
–
Version 1.0
Date
:
Jan. 2022
珠海海芯电子有限公司
Disclaimer
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ollectively, the “
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Version 1.0
–
7
–
Date
:
Jan. 2022
